PIC16F726-I/SP Microchip Technology Inc., PIC16F726-I/SP Datasheet - Page 211
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PIC16F726-I/SP
Manufacturer Part Number
PIC16F726-I/SP
Description
28 PIN, 14 KB FLASH, 1.8V-5.5V, 16 MHZ INT. OSC.
Manufacturer
Microchip Technology Inc.
Datasheet
1.PIC16F726-ISP.pdf
(266 pages)
Specifications of PIC16F726-I/SP
A/d Inputs
11-Channel, 8-Bit
Comparators
2
Cpu Speed
5 MIPS
Eeprom Memory
0 Bytes
Frequency
20 MHz
Input Output
25
Interface
I2C/SPI/USART
Memory Type
Flash
Number Of Bits
8
Package Type
28-pin SPDIP
Programmable Memory
14K Bytes
Ram Size
368 Bytes
Resistance, Drain To Source On
Bytes
Serial Interface
I2C, SPI, AUSART
Speed
20 MHz
Timers
2-8-bit, 1-16-bit
Voltage, Range
1.8-5.5 V
Lead Free Status / Rohs Status
RoHS Compliant part
Electrostatic Device
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23.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Maximum current sunk by all ports
Maximum current sunk by all ports
Maximum current sourced by all ports
Maximum current sourced by all ports
Note 1:
© 2008 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
< 0 or V
............................................................................................................................... 800 mW
SS
pin ......................................................................................................................... 70 mA
pin ...................................................................................................................... 95 mA
PIN
SS
SS
(2)
(2)
, PIC16F72X ............................................................................... -0.3V to +6.5V
, PIC16LF72X ............................................................................. -0.3V to +4.0V
> V
(†)
, -40°C ≤ T
, -40°C ≤ T
(2)
(2)
DD
, 40°C ≤ T
, -40°C ≤ T
SS
)................................................................................................................± 20 mA
........................................................................... -0.3V to (V
A
A
≤ +85°C for industrial ........................................................ 200 mA
≤ +125°C for extended........................................................ 90 mA
A
A
Preliminary
≤ +85°C for industrial ................................................... 140 mA
≤ +125°C for extended................................................... 65 mA
DIS
PIC16F72X/PIC16LF72X
= V
DD
x {I
DD
– ∑ I
OH
} + ∑ {(V
DD
– V
OH
) x I
DS41341B-page 209
OH
} + ∑(V
DD
+ 0.3V)
O
l x I
OL
).
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