TDGL003 Microchip Technology, TDGL003 Datasheet - Page 159

ChipKIT Max32 Development Board PIC32 Boards And Kits

TDGL003

Manufacturer Part Number
TDGL003
Description
ChipKIT Max32 Development Board PIC32 Boards And Kits
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Type
MCUr
Datasheets

Specifications of TDGL003

Silicon Manufacturer
Microchip
Core Architecture
MIPS
Core Sub-architecture
PIC32
Silicon Core Number
PIC32MX
Silicon Family Name
PIC32MX795Fxxxx
Kit Contents
Board Only
Contents
Board
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB®, Arduino™ Mega
TABLE 29-11: DC CHARACTERISTICS: PROGRAM MEMORY
TABLE 29-12: PROGRAM FLASH MEMORY WAIT STATE CHARACTERISTICS
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
D130
D131
D132
D134
D135
D136
D137
D138
Note 1:
Note 1:
Param.
No.
Required Flash wait states
DC CHARACTERISTICS
2:
3:
E
V
V
T
I
T
T
T
T
LVDstartup Flash LVD Delay
DDP
CE
WW
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated.
The minimum SYSCLK for row programming is 4 MHz. Care should be taken to minimize bus activities
during row programming, such as suspending any memory-to-memory DMA operations. If heavy bus
loads are expected, selecting Bus Matrix Arbitration mode 2 (rotating priority) may be necessary. The
default Arbitration mode is mode 1 (CPU has lowest priority).
Refer to the “PIC32MX Flash Programming Specification” (DS61145) for operating conditions during
programming and erase cycles.
40 MHz maximum for PIC32MX320F032H and PIC32MX420F032H devices.
RETD
RW
PE
Symbol
P
PR
PEW
2 Wait States
0 Wait State
1 Wait State
Program Flash Memory
Cell Endurance
V
V
Characteristic Retention
Supply Current during
Programming
Word Write Cycle Time
Row Write Cycle Time
(128 words per row)
Page Erase Cycle Time
Chip Erase Cycle Time
DD
DD
Characteristics
for Read
for Erase or Write
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
(2)
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
1000
V
Min.
3.0
20
20
20
80
SYSCLK
MIN
31 to 60
61 to 80
3
0 to 30
Typical
4.5
10
(1)
-40°C ≤ T
-40°C ≤ T
Max. Units
3.6
3.6
40
6
PIC32MX3XX/4XX
(3)
A
A
-40°C ≤ T
-40°C ≤ T
≤ +85°C for Industrial
≤ +105°C for V-Temp
Year
E/W
Units
mA
ms
ms
ms
MHz
μs
μs
V
V
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Conditions
Comments
DS61143H-page 159

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