TDGL003 Microchip Technology, TDGL003 Datasheet - Page 191

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

30.0
30.1
© 2011 Microchip Technology Inc.
PACKAGING INFORMATION
Package Marking Information
100-Lead TQFP (12x12x1 mm)
64-Lead TQFP (10x10x1 mm)
64-Lead QFN (9x9x0.9 mm)
121-Lead XBGA (10x10x1.1 mm)
Legend: XX...X
Note:
XXXXXXXXXXXX
XXXXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
XXXXXXXXXX
XXXXXXXXXX
XXXXXXXXXX
YYWWNNN
In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
Y
YY
WW
NNN
*
Customer-specific information
Year code (last digit of calendar year)
Year code (last 2 digits of calendar year)
Week code (week of January 1 is week ‘01’)
Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
PIC32MX3XX/4XX
Example
Example
Example
Example
PIC32MX360F
PIC32MX460F
PIC32MX360F
256L-80I/PT
0510017
512H-80I/MR
0510017
512L-80I/BG
0510017
PIC32MX360F
512H-80I/PT
0510017
e
e
e
e
3
3
3
3
e
3
DS61143H-page 191