TDGL003 Microchip Technology, TDGL003 Datasheet - Page 185

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

FIGURE 29-20:
TABLE 29-37: PARALLEL SLAVE PORT REQUIREMENTS
© 2011 Microchip Technology Inc.
AC CHARACTERISTICS
PS1
PS2
PS3
PS4
PS5
PS6
PS7
Note 1:
Param.
No.
PMD<7:0>
TdtV2wrH Data In Valid before WR or CS
TwrH2dtI
TrdL2dtV
TrdH2dtI
Tcs
T
T
Symbol
WR
RD
WR
RD
These parameters are characterized, but not tested in manufacturing.
CS
Inactive (setup time)
WR or CS Inactive to Data –
In Invalid (hold time)
RD and CS Active to Data –
Out Valid
RD Active or CS Inactive to Data –
Out Invalid
CS Active Time
WR Active Time
RD Active Time
PARALLEL SLAVE PORT TIMING
Characteristics
PS3
PS5
PS6
(1)
PS4
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
T
T
T
PB
PB
PB
Min.
20
40
—
0
+ 40
+ 25
+ 25
Typical
PIC32MX3XX/4XX
—
—
—
—
—
—
—
PS1
Max.
PS7
60
10
—
—
—
—
—
-40°C ≤ T
-40°C ≤ T
PS2
Units
ns
ns
ns
ns
ns
ns
ns
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
DS61143H-page 185
Conditions
—
—
—
—
—
—
—