TDGL003 Microchip Technology, TDGL003 Datasheet - Page 166

ChipKIT Max32 Development Board PIC32 Boards And Kits

TDGL003

Manufacturer Part Number
TDGL003
Description
ChipKIT Max32 Development Board PIC32 Boards And Kits
Manufacturer
Microchip Technology
Series
PIC® 32MXr
Type
MCUr
Datasheets

Specifications of TDGL003

Silicon Manufacturer
Microchip
Core Architecture
MIPS
Core Sub-architecture
PIC32
Silicon Core Number
PIC32MX
Silicon Family Name
PIC32MX795Fxxxx
Kit Contents
Board Only
Contents
Board
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
For Use With/related Products
MPLAB®, Arduino™ Mega
PIC32MX3XX/4XX
FIGURE 29-5:
TABLE 29-22: RESETS TIMING
DS61143H-page 166
AC CHARACTERISTICS
SY00
SY01
SY02
SY20
SY30
Note 1:
Param.
No.
Clock Sources = (HS, HSPLL, XT, XTPLL and S
Clock Sources = (FRC, FRCDIV, FRCDIV16, FRCPLL, EC, ECPLL and LPRC)
2:
T
T
T
T
T
Symbol
SYSDLY
PU
PWRT
MCLR
BOR
These parameters are characterized, but not tested in manufacturing.
Data in “Typ” column is at 3.3V, 25°C unless otherwise stated. Characterized by design but not tested.
Power-up Period
Internal Voltage Regulator Enabled
Power-up Period
External Vcore Applied
(Power-Up-Timer Active)
System Delay Period:
Time required to reload Device
Configuration Fuses plus SYSCLK
delay before first instruction is
fetched.
MCLR Pulse Width (low)
BOR Pulse Width (low)
Reset Sequence
Reset Sequence
EXTERNAL RESET TIMING CHARACTERISTICS
Characteristics
BOR
MCLR
(1)
(SY20)
T
(SY30)
T
MCLR
BOR
OSC
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
Min.
48
)
(T
SYSDLY
SY02
Typical
(SY10)
8
T
cycles
OST
SYSCLK
1 μs
400
64
)
2
1
+
(2)
(T
CPU starts fetching code
SYSDLY
SY02
Max.
600
80
-40°C ≤ T
-40°C ≤ T
)
© 2011 Microchip Technology Inc.
Units
CPU starts fetching code
A
A
ms
μs
μs
μs
≤ +85°C for Industrial
≤ +105°C for V-Temp
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
Conditions

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