TDGL003 Microchip Technology, TDGL003 Datasheet - Page 181

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

TABLE 29-35: 10-BIT ADC CONVERSION RATE PARAMETERS
© 2011 Microchip Technology Inc.
1 MIPS to 400 ksps
Up to 400 ksps
Up to 300 ksps
Note 1:
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature -40°C ≤ T
ADC Speed
2:
External V
These parameters are characterized, but not tested in manufacturing.
(1)
REF
Minimum
-40°C ≤ T
- and V
200 ns
200 ns
65 ns
T
AD
REF
A
A
≤ +85°C for Industrial
≤ +105°C for V-Temp
Sampling
Time Min
+ pins must be used for correct operation.
132 ns
200 ns
200 ns
R
5.0 kΩ 2.5V to 3.6V
5.0 kΩ 2.5V to 3.6V
500Ω
S
Max
3.0V to 3.6V
V
DD
PIC32MX3XX/4XX
AN
AN
AN
ANx
ANx or V
x
x or V
x
(2)
REF
ADC Channels Configuration
REF
-
-
SHA
SHA
SHA
CH
CH
CH
X
X
X
DS61143H-page 181
V
V
AV
V
AV
REF
REF
REF
or
or
SS
ADC
SS
ADC
ADC
- V
- V
- V
AV
REF
AV
REF
REF
or
or
DD
DD
+
+
+