TDGL003 Microchip Technology, TDGL003 Datasheet - Page 161

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

29.2
The information contained in this section defines
PIC32MX3XX/4XX AC characteristics and timing
parameters.
FIGURE 29-1:
TABLE 29-16: CAPACITIVE LOADING REQUIREMENTS ON OUTPUT PINS
FIGURE 29-2:
© 2011 Microchip Technology Inc.
AC CHARACTERISTICS
DO56
DO58
Note 1:
Param.
No.
OSC1
AC Characteristics and Timing
Parameters
C
C
Symbol
IO
B
Data in “Typical” column is at 3.3V, 25°C unless otherwise stated. Parameters are for design guidance only
and are not tested.
Load Condition 1 – for all pins except OSC2
All I/O pins and OSC2
SCLx, SDAx
LOAD CONDITIONS FOR DEVICE TIMING SPECIFICATIONS
EXTERNAL CLOCK TIMING
Characteristics
Pin
OS20
V
V
DD
SS
/2
R
C
L
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
L
Min.
—
—
Typical
—
—
R
C
OS30
(1)
L
L
= 464Ω
= 50 pF for all pins
Load Condition 2 – for OSC2
Max. Units
400
50 pF for OSC2 pin (EC mode)
50
Pin
OS30
PIC32MX3XX/4XX
-40°C ≤ T
-40°C ≤ T
pF
pF
OS31
A
A
EC mode
In I
≤ +85°C for Industrial
≤ +105°C for V-Temp
2
V
C™ mode
SS
OS31
C
L
Conditions
DS61143H-page 161