TDGL003 Microchip Technology, TDGL003 Datasheet - Page 61

• Manufacturer Part Number: TDGL003
• Description: ChipKIT Max32 Development Board PIC32 Boards And Kits
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr
• Type: MCUr

Specifications of TDGL003

• Silicon Manufacturer: Microchip
• Core Architecture: MIPS
• Core Sub-architecture: PIC32
• Silicon Core Number: PIC32MX
• Silicon Family Name: PIC32MX795Fxxxx
• Kit Contents: Board Only
• Contents: Board
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• For Use With/related Products: MPLAB®, Arduino™ Mega

TABLE 4-12:
Legend:
Note
5A00 SPI2CON
5A10 SPI2STAT
5A20
5A30 SPI2BRG
5800 SPI1CON
5810 SPI1STAT
5820
5830 SPI1BRG
1:
2:
SPI1BUF
SPI2BUF
x = unknown value on Reset, — = unimplemented, read as ‘0’. Reset values are shown in hexadecimal.
All registers in this table except SPIxBUF have corresponding CLR, SET and INV registers at their virtual addresses, plus offsets of 0x4, 0x8 and 0xC, respectively. See
Registers”
SPI2 Module is not present on PIC32MX420FXXXX/440FXXXX devices.
31:16
31:16
31:16
31:16
31:16
31:16
31:16
31:16
15:0
15:0
15:0
15:0
15:0
15:0
15:0
15:0
SPI1-2 REGISTERS MAP
for more information.
FRMEN
FRMEN
31/15
ON
ON
—
—
—
—
—
—
—
—
FRMSYNC FRMPOL
FRMSYNC FRMPOL
30/14
—
—
—
—
—
—
—
—
—
—
29/13
SIDL
SIDL
—
—
—
—
—
—
—
—
DISSDO
DISSDO
(1,2)
28/12
—
—
—
—
—
—
—
—
—
—
SPIBUSY
SPIBUSY
MODE32
MODE32
27/11
—
—
—
—
—
—
—
—
MODE16
MODE16
26/10
—
—
—
—
—
—
—
—
—
—
SMP
SMP
25/9
—
—
—
—
—
—
—
—
—
—
24/8
CKE
CKE
—
—
—
—
—
—
—
—
DATA<31:0>
DATA<31:0>
Bits
SSEN
SSEN
23/7
—
—
—
—
—
—
—
—
SPIROV
SPIROV
22/6
CKP
CKP
—
—
—
—
—
—
MSTEN
MSTEN
21/5
—
—
—
—
—
—
—
—
BRG<8:0>
BRG<8:0>
20/4
—
—
—
—
—
—
—
—
—
—
SPITBE
SPITBE
19/3
—
—
—
—
—
—
—
—
Section 12.1.1 “CLR, SET and INV
18/2
—
—
—
—
—
—
—
—
—
—
SPIFE
SPIFE
17/1
—
—
—
—
—
—
—
—
SPIRBF
SPIRBF
16/0
—
—
—
—
—
—
—
—
0000
0000
0000
0008
0000
0000
0000
0000
0008
0000
0000
0008
0000
0000
0000
0000