DSP56002FC66 Freescale Semiconductor, DSP56002FC66 Datasheet - Page 79

• Manufacturer Part Number: DSP56002FC66
• Manufacturer: Freescale Semiconductor

Specifications of DSP56002FC66

• Device Core Size: 24b
• Architecture: Harvard
• Format: Fixed Point
• Clock Freq (max): 66MHz
• Mips: 33
• Device Input Clock Speed: 66MHz
• Ram Size: 3KB
• Program Memory Size: 1.5KB
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.5V
• Operating Supply Voltage (max): 5.5V
• Operating Temp Range: -40C to 105C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 132
• Package Type: PQFP
• Lead Free Status / Rohs Status: Supplier Unconfirmed

MOTOROLA
VIEW AB
C
C2
L
Figure 3-3 132-Pin Plastic Quad Flat Pack (PQFP) Mechanical Information
132X
18
50
C1
0.008
D
17
51
0.012
0.002 N
0.010
M
0.016
A1
S1
T
H
T
1
L-M
Freescale Semiconductor, Inc.
H
L-M
2X
L-M
SECTION AA-AA
For More Information On This Product,
L-M
N
J
N
N
132X
A
0.008
N
U
4X
S
4X 33 TIPS
D1
4X
M
N
Go to: www.freescale.com
J1
T
PIN 1
IDENT
AA
L-M
DSP56002/D, Rev. 3
R R1
K
117
N
83
W
H
CASE 831A-02
116
84
AA
M
K1
ISSUE C
P1
T
0.004 T
P
GAGE
PLANE
0.002 L-M
SEATING
PLANE
V1
V
132X
B1
2X
B
NOTES:
1. DIMENSIONING AND TOLERANCING
2. DIMENSIONS IN INCHES.
3. DIMENSIONS A, B, J, AND P DO NOT
4. DATUM PLANE H IS LOCATED AT THE
5. DATUMS L, M, AND N TO BE
6. DIMENSIONS S AND V TO BE
7. DIMENSIONS A, B, J, AND P TO BE
8. DIMENSION F DOES NOT INCLUDE
PER ASME Y14.5M, 1982.
INCLUDE MOLD PROTRUSION.
ALLOWABLE MOLD PROTRUSION
FOR DIMENSIONS A AND B IS 0.007,
FOR DIMENSIONS J AND P IS 0.010.
UNDERSIDE OF LEADS WHERE
LEADS EXIT PACKAGE BODY.
DETERMINED WHERE CENTER
LEADS EXIT PACKAGE BODY AT
DATUM H.
DETERMINED AT SEATING PLANE,
DATUM T.
DETERMINED AT DATUM PLANE H.
DAMBAR PROTRUSIONS. DAMBAR
PROTRUSION SHALL NOT CAUSE THE
LEAD WIDTH TO EXCEED 0.019.
Pin-out and Package Information
METAL
BASE
AC AC
E
SECTION AC-AC
VIEW AB
(D)
D2
C L
128X
DIM
X=L, M, OR N
C1
C2
D1
D2
R1
A1
B1
E1
J1
K1
P1
S1
V1
W
A
B
C
D
E
G
K
P
S
U
V
F
J
X
0.160
0.020
0.135
0.008
0.012
0.008
0.006
0.005
0.014
0.034
0.006
Packaging
G
MIN
1.100 BSC
0.550 BSC
1.100 BSC
0.550 BSC
0.025 BSC
0.950 BSC
0.475 BSC
0.010 BSC
0.950 BSC
0.475 BSC
0.013 REF
1.080 BSC
0.540 BSC
0.025 REF
1.080 BSC
0.540 BSC
E1
0
INCHES
PLATING
0.180
0.040
0.145
0.012
0.016
0.011
0.008
0.007
0.014
0.044
0.008
MAX
3-11
8