SC28L201A1DGG,112 NXP Semiconductors, SC28L201A1DGG,112 Datasheet - Page 105

IC UART W/FIFO 48-TSSOP

SC28L201A1DGG,112

Manufacturer Part Number
SC28L201A1DGG,112
Description
IC UART W/FIFO 48-TSSOP
Manufacturer
NXP Semiconductors
Series
IMPACTr
Datasheet

Specifications of SC28L201A1DGG,112

Features
False-start Bit Detection
Number Of Channels
2, DUART
Fifo's
256 Byte
Voltage - Supply
3.3V, 5V
With Parallel Port
Yes
With Auto Flow Control
Yes
With False Start Bit Detection
Yes
With Modem Control
Yes
With Cmos
Yes
Mounting Type
Surface Mount
Package / Case
48-TSSOP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-3293-5
935277824112
SC28L201A1DGG
Philips Semiconductors
15. Soldering
9397 750 13138
Product data sheet
15.1 Introduction to soldering surface mount packages
15.2 Reflow soldering
15.3 Wave soldering
This text gives a very brief insight to a complex technology. A more in-depth account of
soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is recommended.
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and cooling)
vary between 100 seconds and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 C to 270 C depending on solder paste
material. The top-surface temperature of the packages should preferably be kept:
Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
below 225 C (SnPb process) or below 245 C (Pb-free process)
– for all BGA, HTSSON..T and SSOP..T packages
– for packages with a thickness
– for packages with a thickness < 2.5 mm and a volume
below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be
thick/large packages.
parallel to the transport direction of the printed-circuit board;
Rev. 01 — 31 October 2005
3.3 V, 5 V UART, 3.125 Mbit/s, with 256-byte FIFO
2.5 mm
3
so called small/thin packages.
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
350 mm
SC28L201
3
so called
105 of 110

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