AT32UC3A3256AU Atmel Corporation, AT32UC3A3256AU Datasheet - Page 981

• Manufacturer Part Number: AT32UC3A3256AU
• Manufacturer: Atmel Corporation

Specifications of AT32UC3A3256AU

• Flash (kbytes): 256 Kbytes
• Pin Count: 144
• Max. Operating Frequency: 66 MHz
• Cpu: 32-bit AVR
• # Of Touch Channels: 32
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 110
• Ext Interrupts: 110
• Usb Transceiver: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device + OTG
• Spi: 6
• Twi (i2c): 2
• Uart: 4
• Lin: 4
• Ssc: 1
• Sd / Emmc: 1
• Graphic Lcd: No
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 8
• Adc Resolution (bits): 10
• Adc Speed (ksps): 384
• Resistive Touch Screen: No
• Dac Channels: 2
• Dac Resolution (bits): 16
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 128
• Self Program Memory: YES
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 3.0 to 3.6
• Operating Voltage (vcc): 3.0 to 3.6
• Fpu: No
• Mpu / Mmu: Yes / No
• Timers: 6
• Output Compare Channels: 18
• Input Capture Channels: 12
• Pwm Channels: 12
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: Yes

36. Mechanical Characteristics
36.1
36.1.1
36.1.2
32072G–11/2011
Thermal Considerations
Thermal Data
Junction Temperature
Table 36-1
Table 36-1.
The average chip-junction temperature, T
where:
From the first equation, the user can derive the estimated lifetime of the chip and decide if a
cooling device is necessary or not. If a cooling device is to be fitted on the chip, the second
equation should be used to compute the resulting average chip-junction temperature T
Symbol
θ
θ
θ
θ
θ
θ
1.
2.
• θ
• θ
• θ
• P
• T
JA
JC
JA
JC
JA
JC
page
Table 36-1 on page
characteristics” on page
JA
JC
HEAT SINK
A
D
T
T
= ambient temperature (°C).
= device power consumption (W) estimated from data provided in the section
= package thermal resistance, Junction-to-ambient (°C/W), provided in
= package thermal resistance, Junction-to-case thermal resistance (°C/W), provided in
J
J
=
981.
=
T
summarizes the thermal resistance data depending on the package.
T
A
A
= cooling device thermal resistance (°C/W), provided in the device datasheet.
Parameter
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
Junction-to-ambient thermal resistance
Junction-to-case thermal resistance
+
Thermal Resistance Data
+
P (
(
P
D
D
×
×
θ (
θ
HEATSINK
981.
JA
)
956.
+
θ
JC
) )
J
, in °C can be obtained from the following:
Condition
Still Air
Still Air
Still Air
VFBGA100
TFBGA144
TFBGA144
VFBGA100
TQFP144
TQFP144
Package
Table 36-1 on
40.3
28.5
31.1
Typ
9.5
6.9
6.9
”Regulator
J
° C/W
° C/W
° C/W
in °C.
Unit
981