SAM9X35 Atmel Corporation, SAM9X35 Datasheet - Page 1112
SAM9X35
Manufacturer Part Number
SAM9X35
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(248 pages)
2.SAM9X25.pdf
(45 pages)
3.SAM9X25.pdf
(1145 pages)
4.SAM9X25.pdf
(45 pages)
5.SAM9X25.pdf
(1325 pages)
Specifications of SAM9X35
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
105
Ext Interrupts
105
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
3
Uart
7
Can
2
Lin
4
Ssc
1
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
12
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
DDR/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
- SAM9261 PDF datasheet
- SAM9X25 PDF datasheet #2
- SAM9X25 PDF datasheet #3
- SAM9X25 PDF datasheet #4
- SAM9X25 PDF datasheet #5
- Current page: 1112 of 1325
- Download datasheet (30Mb)
46.3
Figure 46-1. Block Diagram
1112
1112
AHB
Bus
Block Diagram
SAM9X35
SAM9X35
CUE: Chroma Upsampling Engine
CSC: Color Space Conversion
2DSC: Two Dimension Scaler
DEAG: DMA Engine Address Generation
HEO: High End Overlay
32-bit
AHB
Master
Interface
32-bit
APB Interface
Configuration
Registers
DEAG
Unit
HCC
Layer
OVR1
Layer
Base
Layer
HEO
Layer
HCC: Hardware Cursor Channel
GAB: Global Alpha Blender
LTE: LCD Timing Engine
ROT: Hardware Rotation
SYSCTRL
Unit
CUE
CLUT
CLUT
ROT
CLUT
2DSC
CLUT
ROT
CSC
GAB
Unit
LTE
Unit
11055B–ATARM–22-Sep-11
11055B–ATARM–22-Sep-11
LCD_VSYNC
LCD_HSYNC
LCD_PWM
LCD_DAT[23:0]
LCD_PCLK
LCD_DEN
LCD_DISP
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