SAM9X35 Atmel Corporation, SAM9X35 Datasheet - Page 419
SAM9X35
Manufacturer Part Number
SAM9X35
Description
Manufacturer
Atmel Corporation
Datasheets
1.SAM9261.pdf
(248 pages)
2.SAM9X25.pdf
(45 pages)
3.SAM9X25.pdf
(1145 pages)
4.SAM9X25.pdf
(45 pages)
5.SAM9X25.pdf
(1325 pages)
Specifications of SAM9X35
Flash (kbytes)
0 Kbytes
Pin Count
217
Max. Operating Frequency
400 MHz
Cpu
ARM926
Hardware Qtouch Acquisition
No
Max I/o Pins
105
Ext Interrupts
105
Usb Transceiver
3
Usb Speed
Hi-Speed
Usb Interface
Host, Device
Spi
2
Twi (i2c)
3
Uart
7
Can
2
Lin
4
Ssc
1
Ethernet
1
Sd / Emmc
2
Graphic Lcd
Yes
Video Decoder
No
Camera Interface
No
Adc Channels
12
Adc Resolution (bits)
10
Adc Speed (ksps)
440
Resistive Touch Screen
Yes
Temp. Sensor
No
Crypto Engine
No
Sram (kbytes)
32
Self Program Memory
NO
External Bus Interface
1
Dram Memory
DDR/LPDDR, SDRAM/LPSDR
Nand Interface
Yes
Picopower
No
Temp. Range (deg C)
-40 to 85
I/o Supply Class
1.8/3.3
Operating Voltage (vcc)
0.9 to 1.1
Fpu
No
Mpu / Mmu
No/Yes
Timers
6
Output Compare Channels
6
Input Capture Channels
6
Pwm Channels
4
32khz Rtc
Yes
Calibrated Rc Oscillator
No
- SAM9261 PDF datasheet
- SAM9X25 PDF datasheet #2
- SAM9X25 PDF datasheet #3
- SAM9X25 PDF datasheet #4
- SAM9X25 PDF datasheet #5
- Current page: 419 of 1325
- Download datasheet (30Mb)
30. DDR SDR SDRAM Controller (DDRSDRC)
30.1
30.2
11055B–ATARM–22-Sep-11
11055B–ATARM–22-Sep-11
Description
Embedded Characteristics
The DDR SDR SDRAM Controller (DDRSDRC) is a multiport memory controller. It comprises
four slave AHB interfaces. All simultaneous accesses (four independent AHB ports) are inter-
leaved to maximize memory bandwidth and minimize transaction latency due to SDRAM
protocol.
The DDRSDRC extends the memory capabilities of a chip by providing the interface to an exter-
nal 16-bit or 32-bit SDR-SDRAM device and external 16-bit DDR-SDRAM device. The page size
supports ranges from 2048 to 16384 and the number of columns from 256 to 4096. It supports
byte (8-bit), half-word (16-bit) and word (32-bit) accesses.
The DDRSDRC supports a read or write burst length of 8 locations which frees the command
and address bus to anticipate the next command, thus reducing latency imposed by the SDRAM
protocol and improving the SDRAM bandwidth. Moreover it keeps track of the active row in each
bank, thus maximizing SDRAM performance, e.g., the application may be placed in one bank
and data in the other banks. So as to optimize performance, it is advisable to avoid accessing
different rows in the same bank. The DDRSDRC supports a CAS latency of 2 or 3 and optimizes
the read access depending on the frequency.
The features of self refresh, power-down and deep power-down modes minimize the consump-
tion of the SDRAM device.
The DDRSDRC user interface is compliant with ARM Advanced Peripheral Bus (APB rev2).
Note: The term “SDRAM device” regroups SDR-SDRAM, Low-power SDR-SDRAM, Low-
power DDR1-SDRAM and DDR2-SDRAM devices.
• AMBA Compliant Interface, interfaces Directly to the ARM Advanced High performance Bus
• Supports DDR2-SDRAM, Low-power DDR1-SDRAM or DDR2-SDRAM, SDR-SDRAM and
• Numerous Configurations Supported
• Programming Facilities
(AHB)
Low-power SDR-SDRAM
– Four AHB Interfaces, Management of All Accesses Maximizes Memory Bandwidth
– AHB Transfer: Word, Half Word, Byte Access
– 2K, 4K, 8K, 16K Row Address Memory Parts
– SDRAM with Four and Eight Internal Banks
– SDR-SDRAM with 16- or 32-bit Data Path
– DDR-SDRAM with 16-bit Data Path
– One Chip Select for SDRAM Device (256 Mbyte Address Space)
– Multibank Ping-pong Access (Up to or 4 Banks or 8 banks Opened at Same Time =
– Timing Parameters Specified by Software
– Automatic Refresh Operation, Refresh Rate is Programmable
and Minimizes Transaction Latency
Reduces Average Latency of Transactions)
SAM9X35
SAM9X35
419
419
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