mpc8569e Freescale Semiconductor, Inc, mpc8569e Datasheet - Page 122

• Manufacturer Part Number: mpc8569e
• Description: Mpc8569e Powerquicc Iii Integrated Processor Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Mechanical Dimensions of the FC-PBGA with Full Lid
4.2
The following figure shows the mechanical dimensions and bottom surface nomenclature for the MPC8569E FC-PBGA
package with full lid.
122
Mechanical Dimensions of the FC-PBGA with Full Lid
Notes:
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Dimensions and tolerances per ASME Y14.5M-1994.
Maximum solder ball diameter measured parallel to datum A.
Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
Parallelism measurement shall exclude any effect of mark on top surface of package.
All dimensions are symmetric across the package center lines unless dimensioned otherwise.
29.2 mm maximum package assembly (lid and laminate) x and y.
All dimensions are in millimeters.
MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 0
Figure 75. MPC8569E FC-PBGA Package with Full Lid
Freescale Semiconductor