pga370 ETC-unknow, pga370 Datasheet - Page 57

• Manufacturer Part Number: pga370
• Description: Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
• Manufacturer: ETC-unknow

4.2
Datasheet
Table 31. Intel
Table 31
Pentium III processor for the FC-PGA2 package. Systems should design for the highest possible
processor power, even if a processor with a lower thermal dissipation is planned. A thermal
solution should be designed to ensure the case temperature never exceeds these specifications.
NOTES:
Processor Die Area
Figure 21
III processor die layout measurements. The layout differentiates the processor core from the cache
die area. In effect, the thermal design power identified in
processor core area. Thermal solution designs should compensate for this smaller heat flux area
and not assume that the power is uniformly distributed across the entire die area.
10. Tjunction minimum specification is 0 °C.
Processor
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to
4. T
5. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
6. T
7. This specification only applies to 1B GHz S-Spec #: SL4WM. This part has a VID request of 1.70 V, however
8. This specification applies to processors with CPUID 068AH. 1B GHz exists in both FC-PGA and FC-PGA2
9. This specification applies to processors with CPUID 0686H.
1. These values are specified at nominal V
2. Thermal Design Power (TDP) represents the maximum amount of power the thermal solution is required to
3. TDP does not represent the power delivery and voltage regulation requirements for the processor. Refer to
4. T
5. This processor exists in both FC-PGA and FC-PGA2 packages.
1.13 GHz
1B GHz
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tjunction specification.
Table 6 for voltage regulation and electrical specifications.
hottest location on the processor’s core.
die area over which the power is generated. Power for these processors is generated from the core area
shown in
error must be added to the T
processor Thermal Metrology for CPUID-068h Family Processors (Order Number: 245301). Intel has
characterized the use of the Analog Devices AD1021 diode measurement kit and found its measurement
error to be 1 °C.
the processor should be supplied 1.76 V at the PGA Vcc pins by the VRM (Voltage Regulator Module) or by
the voltage regulator circuit.
packages.
dissipate. The thermal solution should be designed to dissipate the TDP power without exceeding the
maximum Tcase specification.
Table 7
temperature on the processor’s core. For more information please refer to the document, Intel
Processor in the FC-PGA2 Package Thermal Design Guide.
junctionoffset
JUNCTION
866
933
CaseOffset
®
Pentium
provides the thermal design power dissipation and maximum temperatures for the
for voltage regulation and electrical specifications.
is a block diagram of the Pentium III processor die layout and
Figure
is the worst-case difference between the maximum case temperature and the thermal diode
offset values do not include any thermal diode kit measurement error. Diode kit measurement
is the worst-case difference between the thermal reading from the on-die thermal diode and the
Frequency
Processor
Pentium
®
(MHz)
Core
21.
1000
1133
866
933
III Processor for the FC-PGA2 Package Thermal Design Power
®
System Bus
III Processor for the PGA370 Socket at 500 MHz to 1.10 GHz
JUNCTION
Frequency
(MHz)
133
133
133
133
offset value from the table, as outlined in the Intel
CC CORE
Thermal Design
CPUID 068Ah
Processor
for the processor pins.
Power
29.5
31.5
33.9
37.5
(W)
2,3
Table 30
Maximum
T
case
(°C)
70
72
69
72
is dissipated entirely from the
4
Table 32
Additional
Notes
5
5
5
®
contains Pentium
Pentium
®
Pentium
®
III
1
®
57
III