pga370 ETC-unknow, pga370 Datasheet - Page 62

• Manufacturer Part Number: pga370
• Description: Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
• Manufacturer: ETC-unknow

Pentium
62
Table 36. Processor Die Loading Parameters for FC-PGA
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
The bare processor die has mechanical load limits that should not be exceeded during heat sink
assembly, mechanical stress testing, or standard drop and shipping conditions. The heatsink attach
solution must not induce permanent stress into the processor substrate with the exception of a
uniform load to maintain the heatsink to the processor thermal interface. The package dynamic and
static loading parameters are listed in
For
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
3. Please see socket manufacturer’s force loading specification also to ensure compliance.
Silicon Die Surface
Silicon Die Edge
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
2. Parameters assume uniformly applied loads.
processor interface.
Table
or load bearing surface for thermal solutions.
Parameter
36, the following apply:
Dynamic (max)
200
100
Table
1
36.
Static (max)
50
12
2
Unit
lbf
lbf
Added
Notes
3
3
Datasheet