pga370 ETC-unknow, pga370 Datasheet - Page 6

• Manufacturer Part Number: pga370
• Description: Mpu Pentium Iii 64-bit 0.18um 700mhz 370-pin Fcpga
• Manufacturer: ETC-unknow

Pentium
Tables
6
®
III Processor for the PGA370 Socket at 500 MHz to 1.13 GHz
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Processor Identification....................................................................................... 10
Voltage Identification Definition........................................................................... 21
System Bus Signal Groups 1 .............................................................................. 23
System Bus Signal Groups (AGTL)1 .................................................................. 23
Frequency Select Truth Table for BSEL[1:0] ...................................................... 26
Absolute Maximum Ratings ................................................................................ 26
Voltage and Current Specifications .................................................................... 28
PL Slew Rate Data (23A) .................................................................................... 33
AGTL / AGTL+ Signal Groups DC Specifications .............................................. 34
Non-AGTL+ Signal Group DC Specifications ..................................................... 34
Non-AGTL Signal Group DC Specifications ....................................................... 35
Processor AGTL+ Bus Specifications ................................................................ 36
Processor AGTL Bus Specifications .................................................................. 36
System Bus AC Specifications (SET Clock) ....................................................... 37
System Bus Timing Specifications (Differential Clock) ....................................... 38
System Bus AC Specifications (AGTL+ or AGTL Signal Group) ........................ 39
System Bus AC Specifications (CMOS Signal Group) ....................................... 40
System Bus AC Specifications (Reset Conditions) ............................................ 40
System Bus AC Specifications (APIC Clock and APIC I/O) ................................ 40
Platform Power-On Timings ................................................................................ 40
BCLK/PICCLK Signal Quality Specifications for Simulation at the
Processor Pins ................................................................................................... 46
BCLK/PICCLK Signal Quality Specifications for Simulation at the Processor Pins
in a Differential Clock Platform for AGTL ............................................................ 46
AGTL+ Signal Groups Ringback Tolerance Specifications at the Processor
Pins .................................................................................................................... 47
Example Platform Information............................................................................. 50
100 MHz AGTL+ / AGTL Signal Group Overshoot/Undershoot Tolerance at
Processor Pins .................................................................................................... 51
133 MHz AGTL+/AGTL Signal Group Overshoot/Undershoot Tolerance .......... 52
33 MHz CMOS Signal Group Overshoot/Undershoot Tolerance at
Processor Pins .................................................................................................... 52
Signal Ringback Specifications for Non-AGTL+ Signal Simulations at the
Processor Pins .................................................................................................... 55
Signal Ringback Specifications for Non-AGTL Signal Simulations at
the Processor Pins ............................................................................................. 55
Intel® Pentium® III Processor Thermal Design Power for the FC-PGA Package ..
56
Intel® Pentium® III Processor for the FC-PGA2 Package Thermal
Design Power...................................................................................................... 57
Processor Functional Die Layout for FC-PGA .................................................... 58
Thermal Diode Parameters ................................................................................. 59
Thermal Diode Interface...................................................................................... 59
Intel® Pentium® III Processor Package Dimensions .......................................... 61
Processor Die Loading Parameters for FC-PGA ................................................ 62
Package Dimensions for Intel® Pentium® III Processor FC-PGA2 Package ..... 63
Processor Case Loading Parameters for FC-PGA2 ........................................... 64
Signal Listing in Order by Signal Name .............................................................. 69
Signal Listing in Order by Pin Number ................................................................ 74
Datasheet