mc56f8335 Freescale Semiconductor, Inc, mc56f8335 Datasheet - Page 128

• Manufacturer Part Number: mc56f8335
• Description: 16-bit Digital Signal Controller
• Manufacturer: Freescale Semiconductor, Inc

1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application. Determined on 2s2p ther-
2. Junction to ambient thermal resistance, Theta-JA (R
3. Junction to case thermal resistance, Theta-JC (R
4. Thermal Characterization Parameter, Psi-JT (Ψ
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board) temperature,
6. See
128
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to ambient
Natural convection
Junction to ambient (@1m/sec)
Junction to case
Junction to center of case
I/O pin power dissipation
Power dissipation
Maximum allowed P
mal test board.
in a horizontal configuration in natural convection. Theta-JA was also simulated on a thermal test board with two internal planes
(2s2p, where “s” is the number of signal layers and “p” is the number of planes) per JESD51-6 and JESD51-7. The correct name
for Theta-JA for forced convection or with the non-single layer boards is Theta-JMA.
plate technique with the cold plate temperature used as the "case" temperature. The basic cold plate measurement technique is
described by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when
the package is being used with a heat sink.
ter of case as defined in JESD51-2. Ψ
vironments.
ambient temperature, air flow, power dissipation of other components on the board, and board thermal resistance.
Part 12.1
ESD for Human Body Model (HBM)
ESD for Machine Model (MM)
ESD for Charge Device Model (CDM)
Characteristic
for more details on thermal design considerations.
D
Characteristic
Table 10-2 ElectroStatic Discharge (ESD) Protection
Table 10-3 Thermal Characteristics
Four layer board (2s2p)
Four layer board (2s2p)
JT
is a useful value to use to estimate junction temperature in steady-state customer en-
Comments
JT
56F8335 Technical Data, Rev. 5
), is the "resistance" from junction to reference point thermocouple on top cen-
θJC
θJA
), was simulated to be equivalent to the measured values using the cold
) was simulated to be equivalent to the JEDEC specification JESD51-2
2000
Min
200
500
Symbol
P
R
R
(2s2p)
R
R
R
P
Ψ
DMAX
P
θJMA
θJMA
θJMA
θJC
θJA
I/O
JT
D
Typ
—
—
—
P
D
(TJ - TA) / R
User-determined
= (I
128-pin LQFP
6
DD
Value
50.8
46.5
43.9
41.7
13.9
1.2
x V
Max
—
—
—
DD
θ
+ P
JA
7
Freescale Semiconductor
I/O
)
Unit
V
V
V
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
W
W
W
Preliminary
Notes
4, 5
1,2
1,2
2
2
3