ST72F324BJ STMICROELECTRONICS [STMicroelectronics], ST72F324BJ Datasheet - Page 171

• Manufacturer Part Number: ST72F324BJ
• Description: 8-bit MCU, 3.8 to 5.5 V operating range with 8 to 32 Kbyte Flash/ROM, 10-bit ADC, 4 timers, SPI, SCI
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

ST72324B
13.5
13.6
Thermal characteristics
Table 117. Thermal characteristics
1. The maximum power dissipation is obtained from the formula P
2. The maximum chip-junction temperature is based on technology characteristics.
Soldering information
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label.
of an application can be defined by the user with the formula: P
internal power (I
application.
Symbol
T
R
Jmax
P
thJA
D
Package thermal resistance (junction to ambient):
Power dissipation
Maximum junction temperature
DD
x V
DD
) and P
PORT
(1)
is the port power dissipation depending on the ports used in the
Ratings
(2)
LQFP44 10x10
LQFP32 7x7
DIP42 600mil
SDIP32 200mil
D
D
= P
= (T
INT
J
-T
+ P
A
) / R
PORT
Package characteristics
thJA
where P
. The power dissipation
Value
500
150
52
70
55
50
INT
is the chip
171/188
°C/W
Unit
mW
°C