MC68HC05P9ACDW FREESCALE [Freescale Semiconductor, Inc], MC68HC05P9ACDW Datasheet - Page 129

• Manufacturer Part Number: MC68HC05P9ACDW
• Description: HCMOS Microcontroller Unit
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal Characteristics
Power Considerations
7-mc68hc05p9a
MOTOROLA
The average chip junction temperature, T
where:
For most applications, P
Ignoring P
Solving equations (1) and (2) for K gives:
where K is a constant pertaining to the particular part. K can be
determined from equation (3) by measuring P
known T
by solving equations (1) and (2) iteratively for any value of T
Thermal Resistance
Plastic Dual In-Line Package (PDIP)
Small Outline Integrated Circuit (SOIC)
T
P
P
P
Freescale Semiconductor, Inc.
JA
A
D
INT
I
/
For More Information On This Product,
O
= ambient temperature in C
= P
= package thermal resistance, junction to ambient in C/W
= power dissipation on input and output pins (user-determined)
= I
A
INT
. Using this value of K, the values of P
CC
I
/
O
+ P
, the relationship between P
Go to: www.freescale.com
V
K
Characteristic
I
CC
/
O
Table 29. Thermal Characteristics
Specifications
=
= chip internal power dissipation
P
D
T
I
/
O
J
P
D
T
=
A
P
=
T
INT
+
A
--------------------------------- -
T
and can be neglected.
J
+
273 C
+
P
K
273 C
D
D
J
and T
, in C can be obtained from:
+
JA
JA
Symbol
D
D
(at equilibrium) for a
J
and T
JA
is approximately:
P
Thermal Characteristics
D
J
2
can be obtained
Value
60
60
Specifications
A
.
Unit
C/W
129
(1)
(2)
(3)