WM8351CGEB/RV WOLFSON [Wolfson Microelectronics plc], WM8351CGEB/RV Datasheet - Page 328

• Manufacturer Part Number: WM8351CGEB/RV
• Manufacturer: WOLFSON [Wolfson Microelectronics plc]

WM8351
30 PACKAGE DIAGRAM
w
2
B: 129 BALL BGA PLASTIC PACKAGE 7
NOTES:
1. PRIMARY DATUM -Z- AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS.
2. THIS DIMENSION INCLUDES STAND-OFF HEIGHT ‘A1’.
3. DIMENSION ‘b’ IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER, PARALLEL TO PRIMARY DATUM -Z-.
4. A1 CORNER IS IDENTIFIED BY INK/LASER MARK ON TOP PACKAGE.
5. BILATERAL TOLERANCE ZONE IS APPLIED TO EACH SIDE OF THE PACKAGE BODY.
6. ‘e’ REPRESENTS THE BASIC SOLDER BALL GRID PITCH.
7. THIS DRAWING IS SUBJECT TO CHANGE WITHOUT NOTICE.
8. FALLS WITHIN JEDEC, MO-195
SIDE VIEW
DETAIL 2
A2
A
Symbols
REF:
bbb
ddd
aaa
ccc
A1
A2
D1
E1
A
b
D
E
e
A
B
C
D
G
H
K
M
N
E
F
J
L
Tolerances of Form and Position
1
13
MIN
aaa
0.18
0.27
12
bbb
Z
Z
11
Z
10
JEDEC, MO-195
BOTTOM VIEW
A1
9
7.00 BSC
6.00 BSC
7.00 BSC
6.00 BSC
0.50 BSC
8
NOM
e
0.66
0.08
0.10
0.15
0.05
D1
7
6
5
Dimensions (mm)
4
DETAIL 2
3
X
2
MAX
7
1.00
0.28
0.37
DETAIL 1
X
1
0.94 mm BODY, 0.50 mm BALL PITCH
e
6
E1
NOTE
6
4
2 X
2 X
A1
CORNER
0.10
0.10
Z
Z
DETAIL 1
TOP VIEW
D
b
SOLDER BALL
5
3
ddd
ccc
Z
Z
X
Y
DM040.C
PD, April 2012, Rev 4.5
E
Production Data
328