TDGL007 Microchip Technology, TDGL007 Datasheet - Page 329

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TDGL007

Manufacturer Part Number
TDGL007
Description
Development Boards & Kits - PIC / DSPIC DIGILENT CEREBOT MC7 MOTOR CONTROL BRD
Manufacturer
Microchip Technology
Datasheet

Specifications of TDGL007

Product
Development Boards
Interface Type
CAN, I2C
Operating Supply Voltage
5 V
TABLE 27-5:
TABLE 27-6:
TABLE 27-7:
© 2011 Microchip Technology Inc.
DC CHARACTERISTICS
HDC72a
HDC72f
HDC72g
Note 1:
DC CHARACTERISTICS
HDO10
HDO16
HDO20
HDO26
DC CHARACTERISTICS
HD130 E
HD134 T
Note 1:
Parameter
Param
Param
No.
No.
No.
2:
Symbol
V
V
RETD
P
Parameters with Doze ratios of 1:2 and 1:64 are characterized, but are not tested in manufacturing.
These parameters are assured by design, but are not characterized or tested in manufacturing.
Programming of the Flash memory is not allowed above 125°C.
Symbol
OL
OH
Typical
DC CHARACTERISTICS: DOZE CURRENT (I
DC CHARACTERISTICS: I/O PIN OUTPUT SPECIFICATIONS
DC CHARACTERISTICS: PROGRAM MEMORY
Program Flash Memory
Cell Endurance
Characteristic Retention
39
18
18
Output Low Voltage
I/O ports
OSC2/CLKO
Output High Voltage
I/O ports
OSC2/CLKO
Characteristic
(1)
dsPIC33FJXXXMCX06A/X08A/X10A
Characteristic
Max
45
25
25
(1)
10,000
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Min
20
2.40
2.41
Min
Doze
Ratio
1:128
1:64
1:2
Typ
Typ
Units
mA
mA
mA
Max
Max
DOZE
0.4
0.4
+150°C
-40°C ≤ T
-40°C ≤ T
-40°C ≤ T
Units
)
Year
E/W
Units
V
V
V
V
A
A
-40° C to +150° C
1000 E/W cycles or less and no
other specifications are violated
A
≤ +150°C for High Temperature
≤ +150°C for High Temperature
≤ +150°C for High Temperature
I
I
I
I
OL
OL
OH
OH
3.3V
Conditions
= 1 mA, V
= 1 mA, V
= -1 mA, V
= -1 mA, V
Conditions
Conditions
DS70594C-page 329
DD
DD
DD
DD
(2)
20 MIPS
= 3.3V
= 3.3V
= 3.3V
= 3.3V

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