XCF128XFTG64C Xilinx Inc, XCF128XFTG64C Datasheet - Page 70

• Manufacturer Part Number: XCF128XFTG64C
• Description: IC PROM SRL 128M GATE 64-FTBGA
• Manufacturer: Xilinx Inc

Specifications of XCF128XFTG64C

• Memory Size: 128Mb
• Programmable Type: In System Programmable
• Voltage - Supply: 1.7 V ~ 2 V
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TBGA
• Access Time: 85ns
• Supply Voltage Range: 1.7V To 2V
• Memory Case Style: FTBGA
• No. Of Pins: 64
• Operating Temperature Range: -40°C To +85°C
• Svhc: No SVHC (15-Dec-2010)
• Package /: RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1578

X-Ref Target - Figure 38
Notes:
1.
2.
3.
DS617 (v3.0.1) January 07, 2010
Product Specification
Any address within the bank can equally be used.
If an error is found, the Status Register must be cleared before further Program/Erase operations.
To read the memory in Asynchronous mode, the CR15 Configuration Register bit must be written to 1.
Status Register
Address & BCh
Address & CBh
Write Block
Write Block
SR7 = 1
SR4 = 1
SR5 = 1
SR5 = 0
Read
Start
End
R
YES
(1)
NO
YES
NO
Command Sequence
Blank Check Error
Figure 38: Blank Check Flowchart and Pseudocode
Error
(2)
(2)
Platform Flash XL High-Density Configuration and Storage Device
www.xilinx.com
blank_check_command (blockToCheck) {
}
writeToFlash (blockToCheck, 0xBC);
writeToFlash (blockToCheck, 0xCB);
/* Memory enters read status state after
the Blank Check Command */
do {
if (status_register.SR4==1) && (status_register.SR5==1)
/* command sequence error */
if (status_register.SR5==1)
/* Blank Check error */
} while (status_register.SR7==0);
status_register = readFlash (blockToCheck);
/* E or G must be toggled */
error_handler () ;
error_handler () ;
/* see note (1) */
DS617_32_101608
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