PIC18F27J53-I/ML Microchip Technology, PIC18F27J53-I/ML Datasheet - Page 57
![IC PIC MCU 128KB FLASH 28QFN](/photos/18/33/183309/qfn-28_sml.jpg)
PIC18F27J53-I/ML
Manufacturer Part Number
PIC18F27J53-I/ML
Description
IC PIC MCU 128KB FLASH 28QFN
Manufacturer
Microchip Technology
Series
PIC® XLP™ 18Fr
Datasheets
1.PIC18LF24J10-ISS.pdf
(32 pages)
2.PIC18F26J13-ISS.pdf
(496 pages)
3.PIC18F26J53-ISS.pdf
(586 pages)
4.PIC18F26J53-ISS.pdf
(12 pages)
Specifications of PIC18F27J53-I/ML
Program Memory Type
FLASH
Program Memory Size
128KB (64K x 16)
Package / Case
*
Core Processor
PIC
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Ram Size
3.8K x 8
Voltage - Supply (vcc/vdd)
2.15 V ~ 3.6 V
Data Converters
A/D 10x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
3.8 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
48 MHz
Number Of Programmable I/os
16
Number Of Timers
8
Operating Supply Voltage
2.15 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Controller Family/series
PIC18
Cpu Speed
48MHz
Embedded Interface Type
I2C, SPI, USART
Digital Ic Case Style
QFN
Supply Voltage Range
1.8V To 5.5V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
- PIC18LF24J10-ISS PDF datasheet
- PIC18F26J13-ISS PDF datasheet #2
- PIC18F26J53-ISS PDF datasheet #3
- PIC18F26J53-ISS PDF datasheet #4
- Current page: 57 of 586
- Download datasheet (6Mb)
4.6.5
The Deep Sleep module contains a dedicated Deep Sleep
BOR (DSBOR) circuit. This circuit may be optionally
enabled through the DSBOREN Configuration bit.
The DSBOR circuit monitors the V
voltage. The behavior of the DSBOR circuit is
described in Section 5.4 “Brown-out Reset (BOR)”.
4.6.6
The RTCC can operate uninterrupted during Deep
Sleep mode. It can wake the device from Deep Sleep
by configuring an alarm.
The RTCC clock source is configured with the
RTCOSC bit (CONFIG3L<1>). The available reference
clock sources are the INTRC and T1OSC/T1CKI. If the
INTRC is used, the RTCC accuracy will directly depend
on the INTRC tolerance.For more information on
configuring the RTCC peripheral, see Section 17.0
“Real-Time Clock and Calendar (RTCC)”.
4.6.7
This section gives the typical sequence for using the Deep
Sleep mode. Optional steps are indicated and additional
information is given in notes at the end of the procedure.
1.
2.
3.
4.
5.
6.
7.
8.
9.
10. If using an RTCC alarm for wake-up, wait until
11. Enter Deep Sleep mode by setting the DSEN bit
12. Once a wake-up event occurs, the device will
13. Determine if the device exited Deep Sleep by
2010 Microchip Technology Inc.
Enable DSWDT (optional).
Configure the DSWDT clock source (optional).
Enable DSBOR (optional).
Enable RTCC (optional).
Configure the RTCC peripheral (optional).
Configure the ULPWU peripheral (optional).
Enable the INT0 Interrupt (optional).
Context save SRAM data by writing to the
DSGPR0 and DSGPR1 registers (optional).
Set the REGSLP bit (WDTCON<7>) and clear
the IDLEN bit (OSCCON<7>).
the RTCSYNC bit (RTCCFG<4>) is clear.
(DSCONH<7>) and issuing a SLEEP instruction.
These two instructions must be executed back
to back.
perform a POR Reset sequence. Code execution
resumes at the device’s Reset vector.
reading the Deep Sleep bit, DS (WDTCON<3>).
This bit will be set if there was an exit from Deep
Sleep mode.
DEEP SLEEP BROWN-OUT RESET
(DSBOR)
RTCC PERIPHERAL AND DEEP
SLEEP
TYPICAL DEEP SLEEP SEQUENCE
(3)
(1)
(1)
DD
supply rail
(3)
(4)
(2)
Preliminary
PIC18F47J53 FAMILY
14. Clear the Deep Sleep bit, DS (WDTCON<3>).
15. Determine the wake-up source by reading the
16. Determine if a DSBOR event occurred during
17. Read the DSGPR0 and DSGPR1 context save
18. Clear the RELEASE bit (DSCONL<0>).
4.6.8
If during Deep Sleep, the device is subjected to
unusual operating conditions, such as an Electrostatic
Discharge (ESD) event, it is possible that internal cir-
cuit states used by the Deep Sleep module could
become corrupted. If this were to happen, the device
may exhibit unexpected behavior, such as a failure to
wake back up.
In order to prevent this type of scenario from occurring,
the
self-monitoring capability. During Deep Sleep, critical
internal nodes are continuously monitored in order to
detect possible Fault conditions (which would not
ordinarily occur). If a Fault condition is detected, the
circuitry will set the DSFLT status bit (DSWAKEL<7>)
and automatically wake the microcontroller from Deep
Sleep, causing a POR Reset.
During Deep Sleep, the Fault detection circuitry is
always enabled and does not require any specific
configuration prior to entering Deep Sleep.
Note 1: DSWDT
DSWAKEH and DSWAKEL registers.
Deep Sleep mode by reading the DSBOR bit
(DSCONL<1>).
registers (optional).
Deep
2: The DSWDT and RTCC clock sources
3: For more information, see Section 17.0
4: For more information on configuring this
DEEP SLEEP FAULT DETECTION
through the devices’ Configuration bits.
For more information, see Section 28.1
“Configuration Bits”.
are selected through the devices’ Con-
figuration bits. For more information, see
Section 28.1 “Configuration Bits”.
“Real-Time
(RTCC)”.
peripheral,
Low-Power Wake-up”.
Sleep
module
and
see
Clock
DSBOR
Section 4.7
includes
DS39964B-page 57
and
are
Calendar
automatic
enabled
“Ultra
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