MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 1242

• Manufacturer Part Number: MC9S12XA256CAL
• Description: IC MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XA256CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 80MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XA
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (10 bit, 16 Channel)
• Package: 112LQFP
• Family Name: HCS12
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 2.5|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Appendix A Electrical Characteristics
A.1.8
Power dissipation and thermal characteristics are closely related. The user must assure that the maximum
operating junction temperature is not exceeded. The average chip-junction temperature (T
obtained from:
T
T
P
The total power dissipation can be calculated from:
P
Two cases with internal voltage regulator enabled and disabled must be considered:
1244
J
A
D
INT
JA
=
=
1. Internal voltage regulator disabled
2. Internal voltage regulator enabled
=
=
Junction Temperature, [ C
Ambient Temperature, [ C
=
Total Chip Power Dissipation, [W]
Package Thermal Resistance, [ C/W]
P
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
P
Chip Internal Power Dissipation, [W]
DDR
IO
IO
is the sum of all output currents on I/O ports associated with V
is the sum of all output currents on I/O ports associated with V
Power Dissipation and Thermal Characteristics
is the current shown in Table A-10. and not the overall current flowing into V
DSON
is valid:
P
INT
R
DSON
=
I
P
R
DD
INT
MC9S12XDP512 Data Sheet, Rev. 2.21
DSON
=
V
P
P
=
DD
V
----------------------------------- - for outputs driven high
IO
IO
T
I
DD5
J
DDR
=
P
+
=
=
=
D
I
V
----------- - for outputs driven low
I
I
OH
DDPLL
OL
OL
T
–
=
i
i
A
V
V
P
;
OH
+
R
R
DDR
INT
DSON
DSON
P
;
D
V
+
+
DDPLL
P
I
DDA
IO
JA
I
I
IO i
IO i
2
2
+
V
DDA
I
DDA
V
DDX
DDX
DDA
and V
and V
Freescale Semiconductor
DDR
DDR
.
.
J
DDR
) in C can be
, which