MC9S12XA256CAL Freescale Semiconductor, MC9S12XA256CAL Datasheet - Page 976

• Manufacturer Part Number: MC9S12XA256CAL
• Description: IC MCU 256K FLASH 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12XA256CAL

• Core Processor: HCS12X
• Core Size: 16-Bit
• Speed: 80MHz
• Connectivity: EBI/EMI, I²C, IrDA, LIN, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• No. Of I/o's: 91
• Eeprom Memory Size: 4KB
• Ram Memory Size: 16KB
• Cpu Speed: 80MHz
• No. Of Timers: 1
• No. Of Pwm Channels: 8
• Digital Ic Case Style: LQFP
• Rohs Compliant: Yes
• Processor Series: S12XA
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SCI, SPI
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 91
• Number Of Timers: 12
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Development Tools By Supplier: EVB9S12XDP512E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 2 (10 bit, 16 Channel)
• Package: 112LQFP
• Family Name: HCS12
• Maximum Speed: 40 MHz
• Operating Supply Voltage: 2.5|5 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Chapter 24 DG128 Port Integration Module (S12XDG128PIMV2)
External Signal Description
This section lists and describes the signals that do connect off-chip.
24.0.3
Table 24-1
“Functional Description”
978
Port
—
A
B
E
K
T
Pin Name
PB[7:0]
PE[6:5]
PE[3:2]
PK[5:0]
PT[7:0]
PA[7:0]
BKGD
shows all the pins and their functions that are controlled by the PIM. Refer to
PE[7]
PE[4]
PE[1]
PE[0]
PK[7]
Signal Properties
If there is more than one function associated with a pin, the priority is
indicated by the position in the table from top (highest priority) to bottom
(lowest priority).
Pin Function
and Priority
XCLKS
ECLKX2
IOC[7:0]
MODC
BKGD
ECLK
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
GPIO
XIRQ
GPIO
GPIO
GPIO
GPIO
IRQ
Table 24-1. Pin Functions and Priorities (Sheet 1 of 5)
for the availability of the individual pins in the different package options.
1
1
MC9S12XDP512 Data Sheet, Rev. 2.21
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
I
I
I
I
I
MODC input during RESET
S12X_BDM communication pin
General-purpose I/O
General-purpose I/O
External clock selection input during RESET
Free-running clock output at Core Clock rate (ECLK x 2)
General-purpose I/O
General-purpose I/O
Free-running clock output at the Bus Clock rate or
programmable divided in normal modes
General-purpose I/O
General-purpose I/O
Maskable level- or falling edge-sensitive interrupt input
General-purpose I/O
Non-maskable level-sensitive interrupt input
General-purpose I/O
General-purpose I/O
General-purpose I/O
Enhanced Capture Timer Channels 7–0 input/output
General-purpose I/O
NOTE
Description
Freescale Semiconductor
Section ,
Pin Function
after Reset
BKGD
GPIO
GPIO
GPIO
GPIO