DF2268FA13V Renesas Electronics America, DF2268FA13V Datasheet - Page 34

• Manufacturer Part Number: DF2268FA13V
• Description: IC H8S/2268 MCU FLASH 100QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2268FA13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-QFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

16.3 Register Description.......................................................................................................... 464
16.4 Operation........................................................................................................................... 466
16.5 Usage Notes ...................................................................................................................... 467
Section 17 LCD Controller/Driver ....................................................................469
17.1 Features ............................................................................................................................. 469
17.2 Input/Output Pins .............................................................................................................. 471
17.3 Register Descriptions ........................................................................................................ 472
17.4 Operation........................................................................................................................... 482
Section 18 DTMF Generation Circuit ...............................................................493
18.1 Features ............................................................................................................................. 493
18.2 Input/Output Pins .............................................................................................................. 494
18.3 Register Descriptions ........................................................................................................ 495
18.4 Operation........................................................................................................................... 497
18.5 Application Circuit Example............................................................................................. 499
18.6 Usage Notes ...................................................................................................................... 499
Section 19 RAM ................................................................................................501
Section 20 ROM ................................................................................................503
20.1 Features ............................................................................................................................. 503
20.2 Mode Transitions .............................................................................................................. 504
20.3 Block Configuration.......................................................................................................... 508
Rev. 5.00 Sep. 01, 2009 Page xxxii of l
REJ09B0071-0500
16.3.1 D/A Data Registers 0 and 1 (DADR0 and DADR1)............................................ 464
16.3.2 D/A Control Register (DACR) ............................................................................ 465
16.5.1 Analog Power Supply Current in Power-Down Mode......................................... 467
16.5.2 Setting for Module Stop Mode............................................................................. 467
17.3.1 LCD Port Control Register (LPCR)..................................................................... 472
17.3.2 LCD Control Register (LCR)............................................................................... 476
17.3.3 LCD Control Register 2 (LCR2).......................................................................... 478
17.4.1 Settings up to LCD Display ................................................................................. 482
17.4.2 Relationship between LCD RAM and Display .................................................... 483
17.4.3 Triple Step-Up Voltage Circuit (Supported Only by the H8S/2268 Group)........ 488
17.4.4 Operation in Power-Down Modes ....................................................................... 489
17.4.5 Low-Power LCD Drive........................................................................................ 490
17.4.6 Boosting the LCD Drive Power Supply............................................................... 492
18.3.1 DTMF Control Register (DTCR)......................................................................... 495
18.3.2 DTMF Load Register (DTLR) ............................................................................. 496
18.4.1 Output Waveform ................................................................................................ 497
18.4.2 Operation Flow .................................................................................................... 498