HD64F3337YCP16 Renesas Electronics America, HD64F3337YCP16 Datasheet - Page 89

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HD64F3337YCP16

Manufacturer Part Number
HD64F3337YCP16
Description
IC H8 MCU FLASH 60K 84PLCC
Manufacturer
Renesas Electronics America
Series
H8® H8/300r
Datasheets

Specifications of HD64F3337YCP16

Core Processor
H8/300
Core Size
8-Bit
Speed
16MHz
Connectivity
Host Interface, I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
74
Program Memory Size
60KB (60K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
84-PLCC
Package
84PLCC
Family Name
H8
Maximum Speed
16 MHz
Operating Supply Voltage
5 V
Data Bus Width
8 Bit
Number Of Programmable I/os
74
Interface Type
HIF/I2C/SCI
On-chip Adc
8-chx10-bit
On-chip Dac
2-chx8-bit
Number Of Timers
3
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

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2.6.4
The power-down state includes three modes: sleep mode, software standby mode, and hardware
standby mode.
Sleep Mode: Is entered when a SLEEP instruction is executed. The CPU halts, but CPU register
contents remain unchanged and the on-chip supporting modules continue to function.
Software Standby Mode: Is entered if the SLEEP instruction is executed while the SSBY
(Software Standby) bit in the system control register (SYSCR) is set. The CPU and all on-chip
supporting modules halt. The on-chip supporting modules are initialized, but the contents of the
on-chip RAM and CPU registers remain unchanged as long as a specified voltage is supplied. I/O
port outputs also remain unchanged.
Hardware Standby Mode: Is entered when the input at the
functions halt, including I/O port output. The on-chip supporting modules are initialized, but on-
chip RAM contents are held.
See section 22, Power-Down State, for further information.
2.7
The CPU is driven by the system clock (ø). The period from one rising edge of the system clock to
the next is referred to as a “state.” Memory access is performed in a two- or three-state bus cycle.
On-chip memory, on-chip supporting modules, and external devices are accessed in different bus
cycles as described below.
2.7.1
On-chip ROM and RAM are accessed in a cycle of two states designated T
word data can be accessed, via a 16-bit data bus. Figure 2.13 shows the on-chip memory access
cycle. Figure 2.14 shows the associated pin states.
Power-Down State
Access Timing and Bus Cycle
Access to On-Chip Memory (RAM and ROM)
STBY
pin goes low. All chip
1
and T
2
. Either byte or
57

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