UPD70F3736GK-GAK-AX Renesas Electronics America, UPD70F3736GK-GAK-AX Datasheet - Page 762

• Manufacturer Part Number: UPD70F3736GK-GAK-AX
• Description: MCU 32BIT V850ES/JX3-L 80-LQFP
• Manufacturer: Renesas Electronics America
• Series: V850ES/Jx3-Lr

Specifications of UPD70F3736GK-GAK-AX

• Package / Case: *
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Speed: 20MHz
• Number Of I /o: 66
• Core Processor: RISC
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Program Memory Size: 256KB (256K x 8)
• Data Converters: A/D 8x10b, D/A 1x8b
• Oscillator Type: Internal
• Peripherals: DMA, LVD, PWM, WDT
• Connectivity: CSI, EBI/EMI, I²C, UART/USART
• Core Size: 32-Bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

762
Notes 1. Address values vary depending on the product.
0000290H
00FFFFFH
0000070H
0000060H
0000000H
2. This is the address when CSIB0 is used. It starts at 0000310H when UARTA0 is used.
3. Address values vary depending on the product.
Note 1
Note 2
μ
μ
μ
μ
PD70F3735
PD70F3736
PD70F3735
PD70F3736
Figure 29-4. Memory Spaces Where Debug Monitor Programs Are Allocated
Interrupt vector for debugging
Access-prohibited area
interrupt vector (4 bytes)
CSI/UART receive
Security ID area
Internal ROM
Reset vector
(10 bytes)
(4 bytes)
(4 bytes)
(2 KB)
Internal ROM Size
Internal RAM Size
CHAPTER 29 ON-CHIP DEBUG FUNCTION
128 KB
256 KB
16 KB
8 KB
Preliminary User’s Manual U18952EJ1V0UD
Internal ROM
area
001F800H to 001FFFFH
003F800H to 003FFFFH
Address Value
Address Value
3FFD000H
3FB9000H
3FFEFFFH
3FFEFF0H
Note 3
Access-prohibited area
Internal RAM
(16 bytes)
: Debugging area
Internal RAM
area