SC900841JVK Freescale Semiconductor, SC900841JVK Datasheet - Page 190

• Manufacturer Part Number: SC900841JVK
• Description: IC POWER MGT 338-MAPBGA
• Manufacturer: Freescale Semiconductor

Specifications of SC900841JVK

• Applications: PC's, PDA's
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 338-TBGA
• Input Voltage: 2.8 V to 4.4 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PACKAGE MECHANICAL OUTLINE DRAWING
profile PBGA. The package has a semi populated matrix that
includes 338 balls. The ball count includes 322 assigned
signal pins and four sets of 4 corner balls.
PACKAGE ASSEMBLY RECOMENDATIONS
190
900841
PACKAGING
The package style is an 11x11 fine interstitial pitch, thin
For improved protection against mechanical shock,
mounted SC900841 BGA package. This corner glue
application is described in the AN3954 - "PCB Layout
Guidelines for SC900841 and SCCSP900842 application
note.
application is the Loctite 3128 board level adhesive applied
at a 0° or 45° dispense angle in a continuous motion and with
the fillet length extended to a minimum of 3 ball rows and
columns at each corner.
Freescale recommends applying corner glue to the
Freescale’s preferred material for the corner glue
Analog Integrated Circuit Device Data
Freescale Semiconductor