SC900841JVK Freescale Semiconductor, SC900841JVK Datasheet - Page 30

• Manufacturer Part Number: SC900841JVK
• Description: IC POWER MGT 338-MAPBGA
• Manufacturer: Freescale Semiconductor

Specifications of SC900841JVK

• Applications: PC's, PDA's
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 338-TBGA
• Input Voltage: 2.8 V to 4.4 V
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Voltage - Supply: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

PIN OUT DESCRIPTION AND BALL MAP
assignments. The ball map of the package is given in
PIN DESCRIPTION
through each ball assigned to the different nodes, 500 mA
30
AA
AB
AC
AD
AE
AF
AG
AH
AJ
900841
M
W
FUNCTIONAL DESCRIPTION
GENERAL DESCRIPTION
A
B
C
D
E
F
G
H
K
L
N
P
R
T
U
V
Y
J
Refer to
The Type Column indicates the maximum average current
PGNDCC
HSNNGT
YMXGPS
YMXYFI1
SWDDQ
PGND21
CSPCC
YMX3G
PVIN21
PGND
SW15
VOUT
VID2
PVIN
NC1
NC1
NC3
NC3
1
8
VOUTBG
LSCCGT
HSCCGT
LSNNGT
PGND15
YMXYFI1
VOUTYM
SWDDQ
SWYMX
PVIN15
SW21
VID6
PVIN
NC1
XYFI
NC3
3G
2
8
Pin Description
SWFBCC
PGNDCC
YMXGPS
PVINYMX
PVINNN
SWDDQ
PGND21
YMX3G
PVIN21
VOUT
PGND
SW15
GPO3
VOUT
CCA
VID0
NC1
NC3
YFI
3
VOUTCC
LSCCGT
HSCCGT
PGND15
VIDEN0
SWDDQ
SWYMX
PAOAC
PVIN15
VOUT
FBNN
SW21
GPO2
GPO0
GPO5
VID4
3G
4
PVINDDQ
GPOVCC
GPOSW2
PVIN1P5
PVIN1P5
PVINCC
PGND21
VIDEN1
PVIN21
PGND
SW15
GPO6
DDQ
5
PVINDDQ
PVINYMX
GPOSW1
GPOSW3
PVIN1P8
PGND15
PVIN15
REFP8
PGND
SW21
LDO
DDQ
3G
6
for a detailed list of pins and ball
PVINDDQ
REFGND
PVINCC
COMS1
FBCCP
FBCCA
PDDR
PGND
GPIO0
GPIO2
VOUT
FBCC
GPO1
VID5
DDQ
FB15
GND
AON
SW
7
PVINDDQ
PVINYMX
VOUT
FBCC
PGND
GPO4
GPO7
VOUT
FB21
GP33
VID1
DDQ
CS
3G
8
VOUTCC
PGNDNN
SWFBNN
GPOSW0
GPOSW
PVIN3P3
FBDDQ
SDATA
FBYMX
Figure 4. SC900841 Package Ball Map (Top view)
PNL33
VOUT
PDDR
VOUT
VID3
CCP
VCC
3G
9
VOUTYM
GND1P5
XGPS33
VOUT
GPIO1
PMIC
10
PWRBTN
VOUTMM
GNDSUB
GNDSUB
GPIOVCC
PVIN2P1
PVIN2P1
GNDREF
COMS2
CSPNN
YMXPA
YMXPA
YMXPA
GPIO3
GND
VCC
SW
SW
SW
11
GNDSUB
GNDSUB
GNDSUB
GND2P1
SDIOGT
YMXPA
YMXPA
YMXPA
CC180
VOUT
PGND
PGND
PGND
SCK
12
GNDSUB
GNDSUB
VOUTVIB
GND1P8
PVINVIB
VCORE
VCORE
GNDSPI
FBSDIO
REFP9
YMXPA
YMXPA
PNL18
VOUT
GTIN
REF
LDO
DIG
FB
13
GNDSUB
GNDSUB
GNDSUB
GNDIMG
VCORE
SPICSB
CORE
VOUT
IMG25
CTRL
GND
GND
14
GNDSUB
RESETB
GNDSUB
GNDSUB
PVINIMG
SPIVCC
SPICLK
ADIN20
YMXPA
ADIN21
IMG28
VOUT
MOSI
MISO
GT
15
Figure 4
PCB will have the same mapping as given in
maximum for HIPWR, 300 mA maximum for MDPWR, and
100 mA maximum for LOPWR
VRCOMP
GNDSUB
GNDSUB
GNDADC
PMICINT
PWRGD
ADIN11
ADIN19
16
EXITSTB
GNDSUB
GNDSUB
GNDSUB
GNDSUB
LSPRP
THERM
TSREF
ADIN13
ADIN15
ADIN14
ADIN16
ADIN18
TRIPB
REFD
17
Y
as a top view. The BGA footprint on the application
VINLSPR
GNDSUB
GNDSUB
GNDSUB
GNDSUB
GNDSUB
LSPRM
ADIN17
GPIO6
XTAL2
18
V33STTS
VYMXPA
GNDSUB
GNDSUB
GNDSUB
GNDSUB
PCHGGT
GPSEN
ADIN12
GPIO4
XTAL1
LSPR
VYMX
AUD3
GND
GND
REV
EN
19
VYMX3G
ADIN10
LSPLM
V33EN
RXINL
GPIO5
20
EN
OTGGTIN
VINLSPL
GNDSUB
RXOUTL
GNDBAT
REFGND
OVPCHG
GNDRTC
OTGGT
MC2IN
GPIO7
AUD4
AUD2
Analog Integrated Circuit Device Data
LSPL
GND
GND
GND
CHG
GT
21
PVINCHG
PVINCHG
GNDSUB
GNDSUB
MCCLK
WLED3
CLK32K
LEDB1
LSPLP
MC1IN
TX1
CFP
22
GNDSUB
V33ISNS
FBBKLT
ISNSINP
ICTEST
RXINR
LEDG1
V3GPA
AUD1
MC2B
RAW
GND
NTC
CHG
HSL
RX1
EN
23
Freescale Semiconductor
HSCHG
HSCHG
FBOTG
HSR
24
GT
GT
LEDSCN
CHGBYP
CPOUT
I2SVCC
LSCHG
LSCHG
LEDR2
V3GPA
REFB
SWFB
STTS
CHG
GT
GT
GT
25
CLK26M
LEDG2
PGND
PGND
VPWR
PGND
PGND
REFA
MC1B
BATP
BKLT
ISNS
OTG
CHG
CHG
TX2
26
Figure
SWBKLT
SWOTG
ISNSINN
GNDCP
WLED1
CHGGT
LEDB2
VINSP
XTAL
VBAT
AUD
NC2
FS2
FS1
NC4
27
RXOUTR
GNDSP
LEDR1
4.
CPC2
PGND
PGND
BATN
CPIN
BCL1
BKLT
GND
BKLT
ISNS
NC2
RX2
OTG
CFM
NC4
28
GNDAUD
GNDLED
SWBKLT
SWOTG
WLED2
VNTC
CPC1
XTAL
BCL2
COIN
CELL
SPM
NC2
NC2
SPP
NC4
NC4
29