56-U04-E01 Spectrum Control, 56-U04-E01 Datasheet - Page 52

• Manufacturer Part Number: 56-U04-E01
• Description: USB CONNECTOR, RECEPTACLE, 4POS, THD
• Manufacturer: Spectrum Control
• Series: USB-Er

Specifications of 56-U04-E01

• Connector Type: USB
• No. Of Contacts: 4
• Contact Termination: Right Angle Through Hole
• Connector Mounting: PCB
• Gender: Receptacle
• Contact Plating: Gold
• Product: USB Type A Connectors
• Standard: USB
• Number Of Ports: 1
• Features: Spectrum USB Filtered Connectors TYPE A R/A USB .05pF 5A 10VDC
• Insulation Resistance: 10 MOhms
• Mounting Angle: Right
• Number Of Positions / Contacts: 4
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

52
Surface Mount EMI Filters
Three Terminal Chips
Soldering Specifications
Soldering Instructions
Reflow Soldering
Reflow Soldering
General Soldering Notes
1. High soldering temperatures and long
These conditions can also decrease capaci-
tance value. Use the above recommended
2. Due to the mechanical characteristic of
solder temperature profile as a guide.
SPECTRUM CONTROL INC. • 8031 Avonia Rd. • Fairview, PA 16415 • Phone: [phone] • Fax: [phone] • Web site: www.spectrumcontrol.com
SPECTRUM CONTROL GmbH • Hansastrasse 6 • 91126 Schwabach, Germany • Phone: [phone] • Fax: [phone]
C
Style/Size
soldering times can cause leaching of the
termination and adversely affect adhesion.
solder temperature cycle.
ceramic composition, aggressive thermal
shock will degrade performance. Preheat the
assembly before soldering using the above
Recommended Board Pattern
Recommended Solder Temperature Profile
SF0805
SF1205
SF1806
Body
250
200
150
100
50
0
Top view
A
B
130 to 150°C
Preheat
Board Pattern Dimensions in inches (mm)
60-120
0.024
0.051
0.079
(0.6)
(1.3)
(2.0)
A
Through hole
.016 to .024
(0.4 to 0.6)
Seconds
220 to 240°C
Connects
to top
10 max.
Dimension
Solder
0.059
0.091
0.138
(1.5)
(2.3)
(3.5)
B
Cool down
Bottom view
120 min.
Copper
0.039
0.047
0.051
(1.0)
(1.2)
(1.3)
C
Flow Soldering
Flow Soldering
3. Use mild flux (less than 0.2% by weight of
4. Ultrasonic Cleaning
Style/Size
SF0805
SF1205
SF1806
Body
Chlorine), preferable rosin based. If water
soluble, wash thoroughly to assure all
residue is removed from the underside
of components.
When using an ultrasonic cleaning method,
the following range is recommended:
Recommended Board Pattern
Recommended Solder Temperature Profile
E
250
200
150
100
D
50
Copper
Resist
0
Frequency: Not to exceed 28KHz
Output Power: Not to exceed 20W/liter
Cleaning Time: 5 minutes max
0.024 0.031 0.059 0.039 0.087 0.024
0.051 0.059 0.091 0.047 0.118 0.024
0.059 0.079 0.138 0.051 0.118 0.024
(0.6)
(1.3)
(1.5)
130 to 150°C
A
Preheat
Top view
60-120
Board Pattern Dimensions in inches (mm)
A
B
C
(0.8)
(1.5)
(1.5)
B
Seconds
Connects
to top
Through hole
.016 to .024
(0.4 to 0.6)
(1.5)
(2.3)
(3.5)
Dimension
220 to 250°C
C
Solder
3-4
F
(1.0)
(1.2)
(1.3)
D
Bottom view
Cool down
120 min.
(2.2)
(3.0)
(3.0)
E
(0.6)
(0.6)
(0.6)
F