MC9S08AW32CFGE Freescale, MC9S08AW32CFGE Datasheet - Page 17

• Manufacturer Part Number: MC9S08AW32CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW32CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 32KB
• Lead Free Status / RoHS Status: Compliant

Section Number
15.1 Introduction ...................................................................................................................................261
15.2 Background Debug Controller (BDC) ..........................................................................................262
15.3 On-Chip Debug System (DBG) ....................................................................................................271
15.4 Register Definition ........................................................................................................................275
A.1 Introduction ....................................................................................................................................283
A.2 Parameter Classification.................................................................................................................283
A.3 Absolute Maximum Ratings...........................................................................................................283
A.4 Thermal Characteristics..................................................................................................................285
A.5 ESD Protection and Latch-Up Immunity .......................................................................................286
A.6 DC Characteristics..........................................................................................................................287
A.7 Supply Current Characteristics.......................................................................................................291
A.8 ADC Characteristics.......................................................................................................................293
A.9 Internal Clock Generation Module Characteristics ........................................................................296
A.10 AC Characteristics..........................................................................................................................300
A.11 SPI Characteristics .........................................................................................................................303
A.12 FLASH Specifications....................................................................................................................306
A.13 EMC Performance..........................................................................................................................307
Freescale Semiconductor
15.1.1
15.2.1
15.2.2
15.2.3
15.2.4
15.3.1
15.3.2
15.3.3
15.3.4
15.3.5
15.3.6
15.4.1
15.4.2
15.4.3
A.9.1
A.10.1 Control Timing ..............................................................................................................300
A.10.2 Timer/PWM (TPM) Module Timing.............................................................................302
A.13.1 Radiated Emissions .......................................................................................................307
A.13.2 Conducted Transient Susceptibility...............................................................................307
Features .........................................................................................................................262
BKGD Pin Description .................................................................................................263
Communication Details ................................................................................................264
BDC Commands ...........................................................................................................268
BDC Hardware Breakpoint ..........................................................................................270
Comparators A and B ...................................................................................................271
Bus Capture Information and FIFO Operation .............................................................271
Change-of-Flow Information ........................................................................................272
Tag vs. Force Breakpoints and Triggers .......................................................................272
Trigger Modes ..............................................................................................................273
Hardware Breakpoints ..................................................................................................275
BDC Registers and Control Bits ...................................................................................275
System Background Debug Force Reset Register (SBDFR) ........................................277
DBG Registers and Control Bits ..................................................................................278
ICG Frequency Specifications.......................................................................................297
Electrical Characteristics and Timing Specifications
Development Support
MC9S08AW60 Data Sheet, Rev 2
Appendix A
Chapter 15
Title
Page
17