MC9S08AW32CFGE Freescale, MC9S08AW32CFGE Datasheet - Page 267

MC9S08AW32CFGE

Manufacturer Part Number
MC9S08AW32CFGE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08AW32CFGE

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
34
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
32KB
Lead Free Status / RoHS Status
Compliant

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Figure 15-4
asynchronous to the target MCU, there is a 0-to-1 cycle delay from the host-generated falling edge on
BKGD to the start of the bit time as perceived by the target MCU. The host initiates the bit time but the
target HCS08 finishes it. Because the target wants the host to receive a logic 0, it drives the BKGD pin low
for 13 BDC clock cycles, then briefly drives it high to speed up the rising edge. The host samples the bit
level about 10 cycles after starting the bit time.
Freescale Semiconductor
SPEED-UP PULSE
PERCEIVED START
TO BKGD PIN
TARGET MCU
(TARGET MCU)
HOST DRIVE
DRIVE AND
BDC CLOCK
OF BIT TIME
BKGD PIN
shows the host receiving a logic 0 from the target HCS08 MCU. Because the host is
Figure 15-4. BDM Target-to-Host Serial Bit Timing (Logic 0)
10 CYCLES
MC9S08AW60 Data Sheet, Rev 2
HOST SAMPLES BKGD PIN
10 CYCLES
HIGH-IMPEDANCE
SPEEDUP
PULSE
Chapter 15 Development Support
EARLIEST START
OF NEXT BIT
267

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