MC9S08AW32CFGE Freescale, MC9S08AW32CFGE Datasheet - Page 60

• Manufacturer Part Number: MC9S08AW32CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW32CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 32KB
• Lead Free Status / RoHS Status: Compliant

Chapter 4 Memory
SEC01:SEC00 changes to 1:0 after successful backdoor key entry or a successful blank check of FLASH.
4.6.3
Bits 7 through 5 may be read or written at any time. Bits 4 through 0 always read 0 and cannot be written.
60
KEYACC
Reset
Field
5
W
R
FLASH Configuration Register (FCNFG)
Enable Writing of Access Key — This bit enables writing of the backdoor comparison key. For more detailed
information about the backdoor key mechanism, refer to
0 Writes to $FFB0–$FFB7 are interpreted as the start of a FLASH programming or erase command.
1 Writes to NVBACKKEY ($FFB0–$FFB7) are interpreted as comparison key writes.
0
0
7
= Unimplemented or Reserved
0
0
6
Figure 4-8. FLASH Configuration Register (FCNFG)
SEC01:SEC00
Table 4-10. FCNFG Register Field Descriptions
0:0
0:1
1:0
1:1
KEYACC
0
5
MC9S08AW60 Data Sheet, Rev 2
Table 4-9. Security States
0
0
4
Description
Section 4.5,
3
0
0
Description
unsecured
secure
secure
secure
“Security.”
0
0
2
Freescale Semiconductor
0
0
1
0
0
0