MC9S08AW32CFGE Freescale, MC9S08AW32CFGE Datasheet - Page 285

• Manufacturer Part Number: MC9S08AW32CFGE
• Manufacturer: Freescale

Specifications of MC9S08AW32CFGE

• Cpu Family: HCS08
• Device Core Size: 8b
• Frequency (max): 40MHz
• Interface Type: I2C/SCI/SPI
• Total Internal Ram Size: 2KB
• # I/os (max): 34
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.7V
• On-chip Adc: 8-chx10-bit
• Instruction Set Architecture: CISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 44
• Package Type: LQFP
• Program Memory Type: Flash
• Program Memory Size: 32KB
• Lead Free Status / RoHS Status: Compliant

A.4
This section provides information about operating temperature range, power dissipation, and package
thermal resistance. Power dissipation on I/O pins is usually small compared to the power dissipation in
on-chip logic and it is user-determined rather than being controlled by the MCU design. In order to take
P
V
loads), the difference between pin voltage and V
The average chip-junction temperature (T
where:
For most applications, P
(if P
Freescale Semiconductor
I/O
DD
I/O
into account in power calculations, determine the difference between actual pin voltage and V
and multiply by the pin current for each I/O pin. Except in cases of unusually high pin current (heavy
is neglected) is:
Thermal Characteristics
T
θ
P
P
P
JA
1
2
3
4
A
D
int
I/O
Thermal resistance
64-pin QFP
64-pin LQFP
48-pin QFN
44-pin LQFP
= Ambient temperature, °C
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power dissipation
of other components on the board, and board thermal resistance.
Junction to Ambient Natural Convection
1s - Single Layer Board, one signal layer
2s2p - Four Layer Board, 2 signal and 2 power layers
= P
= Package thermal resistance, junction-to-ambient, °C/W
= I
= Power dissipation on input and output pins — user determined
int
DD
+ P
× V
I/O
I/O
DD
<< P
, Watts — chip internal power
1,2,3,4
int
Rating
and can be neglected. An approximate relationship between P
Table A-3. Thermal Characteristics
P
MC9S08AW60 Data Sheet, Rev 2
T
D
J
= K ÷ (T
J
= T
) in °C can be obtained from:
A
+ (P
SS
J
D
+ 273°C)
or V
× θ
Appendix A Electrical Characteristics and Timing Specifications
JA
2s2p
2s2p
2s2p
2s2p
DD
)
1s
1s
1s
1s
will be very small.
Symbol
θ
JA
Value
57
43
69
54
84
27
73
56
°C/W
Unit
D
Eqn. A-1
Eqn. A-2
and T
SS
or
285
J