MC9S08AW32CFGE Freescale, MC9S08AW32CFGE Datasheet - Page 261

MC9S08AW32CFGE

Manufacturer Part Number
MC9S08AW32CFGE
Description
Manufacturer
Freescale
Datasheet

Specifications of MC9S08AW32CFGE

Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
40MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
2KB
# I/os (max)
34
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
3.3/5V
Operating Supply Voltage (max)
5.5V
Operating Supply Voltage (min)
2.7V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
44
Package Type
LQFP
Program Memory Type
Flash
Program Memory Size
32KB
Lead Free Status / RoHS Status
Compliant

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Chapter 15
Development Support
15.1
Introduction
Development support systems in the HCS08 include the background debug controller (BDC) and the
on-chip debug module (DBG). The BDC provides a single-wire debug interface to the target MCU that
provides a convenient interface for programming the on-chip FLASH and other nonvolatile memories. The
BDC is also the primary debug interface for development and allows non-intrusive access to memory data
and traditional debug features such as CPU register modify, breakpoints, and single instruction trace
commands.
In the HCS08 family, address and data bus signals are not available on external pins (not even in test
modes). Debug is done through commands fed into the target MCU via the single-wire background debug
interface. The debug module provides a means to selectively trigger and capture bus information so an
external development system can reconstruct what happened inside the MCU on a cycle-by-cycle basis
without having external access to the address and data signals.
The alternate BDC clock source for MC9S08AW60 Series is the ICGLCLK. See
Chapter 8, “Internal
Clock Generator
(S08ICGV4)” for more information about ICGCLK and how to select clock sources.
MC9S08AW60 Data Sheet, Rev 2
Freescale Semiconductor
261

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