LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 35
![MCU 32BIT ARM CORTEX M3 256BGA](/photos/27/78/277808/lbga156_sml.jpg)
LPC1850FET256,551
Manufacturer Part Number
LPC1850FET256,551
Description
MCU 32BIT ARM CORTEX M3 256BGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheet
1.LPC1830FET256551.pdf
(87 pages)
Specifications of LPC1850FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
200K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Processor Series
LPC1850
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
200 KB
Interface Type
SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6682
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1850FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1850FET256,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
Fig 4.
0x1E00 0000
0x1D00 0000
0x1C00 0000
0x1008 A000
0x1F00 0000
0x2000 0000
0x1040 8000
0x1040 0000
0x1008 0000
0x1001 8000
0x1001 0000
0x1000 0000
LPC1850/30/20/10 Memory mapping (overview)
7.9 Memory mapping
16 MB static external memory CS3
16 MB static external memory CS2
16 MB static external memory CS1
16 MB static external memory CS0
32 kB local SRAM (LPC1850/30)
32 kB + 8 kB local SRAM
(LPC1850/30/20/10)
(LPC1850/30/20/10)
64 kB local SRAM
32 kB ROM
reserved
reserved
reserved
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
0 GB
1 GB
4 GB
256 MB dynamic external memory DYCS3
256 MB dynamic external memory DYCS2
256 MB dynamic external memory DYCS1
128 MB dynamic external memory DYCS0
16 kB AHB SRAM (LPC1850/30/20/10)
16 kB AHB SRAM (LPC1850/30/20/10)
16 kB AHB SRAM (LPC1850/30/20)
16 kB AHB SRAM (LPC1850/30/20)
32 MB AHB SRAM bit banding
peripheral bit band alias region
external static memory banks
clocking/reset peripherals
RTC domain peripherals
256 MB shadow area
LPC1850/30/20/10
APB peripherals #3
APB peripherals #2
APB peripherals #1
APB peripherals #0
32-bit ARM Cortex-M3 microcontroller
high-speed GPIO
ARM private bus
AHB peripherals
local SRAM/
LPC1850/30/20/10
SPIFI data
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
reserved
AES
© NXP B.V. 2011. All rights reserved.
0xFFFF FFFF
0xE010 0000
0xE000 0000
0x8800 0000
0x8000 0000
0x7000 0000
0x6000 0000
0x4400 0000
0x4200 0000
0x4010 2000
0x4010 1000
0x4010 0000
0x400F 2000
0x400F 1000
0x400F 0000
0x400E 0000
0x400D 0000
0x400C 0000
0x400B 0000
0x400A 0000
0x4009 0000
0x4008 0000
0x4006 0000
0x4005 0000
0x4004 0000
0x4001 2000
0x4000 0000
0x3000 0000
0x2800 0000
0x2400 0000
0x2200 0000
0x2001 0000
0x2000 C000
0x2000 8000
0x2000 4000
0x2000 0000
0x1000 0000
0x0000 0000
002aaf228
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