LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 55

• Manufacturer Part Number: LPC1850FET256,551
• Description: MCU 32BIT ARM CORTEX M3 256BGA
• Manufacturer: NXP Semiconductors
• Series: LPC18xxr

Specifications of LPC1850FET256,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 150MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
• Number Of I /o: 80
• Program Memory Size: -
• Program Memory Type: ROMless
• Eeprom Size: -
• Ram Size: 200K x 8
• Voltage - Supply (vcc/vdd): 2.2 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 256-LBGA
• Processor Series: LPC1850
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 200 KB
• Interface Type: SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
• Maximum Clock Frequency: 150 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Operating Temperature Range: - 40 C to + 85 C
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6682

NXP Semiconductors
Table 8.
T
LPC1850_30_20_10
Objective data sheet
Symbol
Digital pins
I
I
I
V
V
V
V
V
V
V
I
I
I
I
I
I
Open-drain I
V
V
V
V
I
IL
IH
OZ
OH
OL
OHS
OLS
pd
pu
LI
amb
I
O
IH
IL
hys
OH
OL
IH
IL
hys
OL
=

40

Static characteristics
C to +85
2
C0-bus pins
Parameter
LOW-level input current V
HIGH-level input
current
OFF-state output
current
input voltage
output voltage
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
HIGH-level output
voltage
LOW-level output
voltage
HIGH-level output
current
LOW-level output
current
HIGH-level short-circuit
output current
LOW-level short-circuit
output current
pull-down current
pull-up current
HIGH-level input
voltage
LOW-level input voltage
hysteresis voltage
LOW-level output
voltage
input leakage current

C, unless otherwise specified.
…continued
All information provided in this document is subject to legal disclaimers.
Conditions
resistor disabled
V
pull-down resistor
disabled
V
on-chip pull-up/down
resistors disabled
pin configured to provide
a digital function
output active
I
I
V
V
V
V
V
V
V
I
V
V
OH
OL
OLS
I
I
O
OH
OL
OH
OL
I
I
DD(IO)
I
I
= 0 V; on-chip pull-up
= V
= 3.6 V
= 0 V
= V
= 5 V
= 0 V; V
= 4 mA
= 4 mA
= 0.4 V
= V
= V
= 0 V
= <tbd> mA
Rev. 1.2 — 17 February 2011
DD(IO)
DD(IO)
< V
DD(IO)
DD(IO)
I
; on-chip
O
< 3.6 V
= V
 0.4 V
DD(IO)
;
[9][10]
[12]
[12]
[13]
[11]
32-bit ARM Cortex-M3 microcontroller
Min
-
-
-
<tbd>
<tbd>
<tbd>
-
<tbd>
V
0.4
-
<tbd>
<tbd>
-
-
<tbd>
<tbd>
<tbd>
<tbd>
-
-
-
-
-
DD(IO)
LPC1850/30/20/10

Typ
-
-
-
-
-
-
-
-
-
-
-
-
-
-
<tbd>
<tbd>
<tbd>
-
-
<tbd>
-
<tbd>
<tbd>
[1]
© NXP B.V. 2011. All rights reserved.
Max
<tbd>
<tbd>
<tbd>
<tbd>
V
-
<tbd>
-
-
<tbd>
-
-
<tbd>
<tbd>
<tbd>
<tbd>
<tbd>
-
<tbd>
-
<tbd>
<tbd>
<tbd>
DD(IO)
55 of 87
Unit
A
A
A
V
V
V
V
V
V
V
mA
mA
mA
mA
A
A
A
V
V
V
V
A
A