LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 80
![MCU 32BIT ARM CORTEX M3 256BGA](/photos/27/78/277808/lbga156_sml.jpg)
LPC1850FET256,551
Manufacturer Part Number
LPC1850FET256,551
Description
MCU 32BIT ARM CORTEX M3 256BGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheet
1.LPC1830FET256551.pdf
(87 pages)
Specifications of LPC1850FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
200K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Processor Series
LPC1850
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
200 KB
Interface Type
SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6682
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1850FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1850FET256,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
LPC1850_30_20_10
Objective data sheet
13.3 XTAL and RTCX Printed Circuit Board (PCB) layout guidelines
The crystal should be connected on the PCB as close as possible to the oscillator input
and output pins of the chip. Take care that the load capacitors C
third overtone crystal usage have a common ground plane. The external components
must also be connected to the ground plain. Loops must be made as small as possible in
order to keep the noise coupled in via the PCB as small as possible. Also parasitics
should stay as small as possible. Values of C
accordingly to the increase in parasitics of the PCB layout.
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
x1
and C
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
x2
should be chosen smaller
x1
, C
x2
, and C
© NXP B.V. 2011. All rights reserved.
x3
in case of
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