LPC1850FET256,551 NXP Semiconductors, LPC1850FET256,551 Datasheet - Page 85
![MCU 32BIT ARM CORTEX M3 256BGA](/photos/27/78/277808/lbga156_sml.jpg)
LPC1850FET256,551
Manufacturer Part Number
LPC1850FET256,551
Description
MCU 32BIT ARM CORTEX M3 256BGA
Manufacturer
NXP Semiconductors
Series
LPC18xxr
Datasheet
1.LPC1830FET256551.pdf
(87 pages)
Specifications of LPC1850FET256,551
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
150MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, SD/MMC, SPI, SSI, SSP, UART/USART, USB, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
Number Of I /o
80
Program Memory Size
-
Program Memory Type
ROMless
Eeprom Size
-
Ram Size
200K x 8
Voltage - Supply (vcc/vdd)
2.2 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
256-LBGA
Processor Series
LPC1850
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
200 KB
Interface Type
SPI Flash (SPIFI), USB, Ethernet, LCD, External Memory Controller, I2C
Maximum Clock Frequency
150 MHz
Number Of Programmable I/os
80
Number Of Timers
6
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Operating Temperature Range
- 40 C to + 85 C
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6682
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LPC1850FET256,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
Part Number:
LPC1850FET256,551
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
18. Contact information
For more information, please visit:
For sales office addresses, please send an email to:
LPC1850_30_20_10
Objective data sheet
http://www.nxp.com
All information provided in this document is subject to legal disclaimers.
Rev. 1.2 — 17 February 2011
salesaddresses@nxp.com
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
17.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
32-bit ARM Cortex-M3 microcontroller
LPC1850/30/20/10
© NXP B.V. 2011. All rights reserved.
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