XC3S400-4PQ208C Xilinx Inc, XC3S400-4PQ208C Datasheet - Page 119

• Manufacturer Part Number: XC3S400-4PQ208C
• Description: IC SPARTAN-3 FPGA 400K 208PQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-3r

Specifications of XC3S400-4PQ208C

• Number Of Logic Elements/cells: 8064
• Number Of Labs/clbs: 896
• Total Ram Bits: 294912
• Number Of I /o: 141
• Number Of Gates: 400000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 208-BFQFP
• Other names: Q2844431; XC3S4004PQ208C; XC3S4004PQ208C

Package Overview
Table 80
package styles for the Spartan-3 family. Each package style
is available as a standard and an environmentally-friendly
lead-free (Pb-free) option. The Pb-free packages include an
extra ‘G’ in the package style name. For example, the stan-
dard "VQ100" package becomes "VQG100" when ordered
Table 80: Spartan-3 Family Package Options
Selecting the Right Package Option
Spartan-3 FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 81: Comparing Spartan-3 Packaging Options
DS099-4 (v2.5) December 4, 2009
Product Specification
Notes:
1.
FG1156 / FGG1156
Maximum User I/O
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
CP132 / CPG132
VQ100 / VQG100
PQ208 / PQG208
TQ144 / TQG144
FG320 / FGG320
FG456 / FGG456
FG676 / FGG676
FG900 / FGG900
FT256 / FTG256
The CP132, CPG132, FG1156, and FGG1156 packages are being discontinued and are not recommended for new designs. See
http://www.xilinx.com/support/documentation/spartan-3_customer_notices.htm
Package
shows the 10 low-cost, space-saving production
R
Characteristic
(1)
(1)
Leads
1156
100
132
144
208
256
320
456
676
900
Very-thin Quad Flat Pack
Chip-Scale Package
Thin Quad Flat Pack
Quad Flat Pack
Fine-pitch, Thin Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Fine-pitch Ball Grid Array
Type
www.xilinx.com
Quad Flat-Pack (QFP)
as the Pb-free option. The mechanical dimensions of the
standard and Pb-free packages are similar, as shown in the
mechanical drawings provided in
Not all Spartan-3 densities are available in all packages.
However, for a specific package there is a common footprint
for that supports the various devices available in that pack-
age. See the footprint diagrams that follow.
packages are superior in almost every other aspect, as
summarized in
using BGA packaging whenever possible.
Possible
Limited
Good
Fair
Fair
141
4
Maximum
Spartan-3 FPGA Family: Pinout Descriptions
141
173
221
333
489
633
784
I/O
63
89
97
Table
for the latest updates.
81. Consequently, Xilinx recommends
Pitch
(mm)
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
1.0
1.0
Ball Grid Array (BGA)
Table
30.6 x 30.6
Footprint
Very Difficult
16 x 16
22 x 22
17 x 17
19 x 19
23 x 23
27 x 27
31 x 31
35 x 35
(mm)
8 x 8
Better
Better
Better
Better
82.
633
6
Height
(mm)
1.20
1.10
1.60
4.10
1.55
2.00
2.60
2.60
2.60
2.60
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