tmp86fh09amg TOSHIBA Semiconductor CORPORATION, tmp86fh09amg Datasheet - Page 193

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tmp86fh09amg

Manufacturer Part Number
tmp86fh09amg
Description
8 Bit Microcontroller Tlcs-870/c Series
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet

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17.7
17.8
Note 1: To ensure stable oscillation, the resonator position, load capacitance, etc. must be appropriate. Because these fac-
Note 2: The product numbers and specifications of the resonators supplied by Murata Manufacturing Co., Ltd. are subject
Oscillating Conditions
Handling Precaution
-
-
tors are greatly affected by board patterns, please be sure to evaluate operation on the board on which the de-
vice will actually be mounted.
to change. For up to date information, please refer to the following.
http://www.murata.com
The solderability test conditions are shown below.
When using the device (oscillator) in places exposed to high electric fields such as cathode-ray tubes, we
recommend electrically shielding the package in order to maintain normal operating condition.
1. When using the Sn-37Pb solder bath
Solder bath temperature = 230 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
2. When using the Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245 °C
Dipping time = 5 seconds
Number of times = once
R-type flux used
The pass criterion of the above test is as follows: Solderability rate until forming ≥ 95 %
C
(1) High-frequency Oscillation
1
XIN
XOUT
C
Page 183
2
C
(2) Low-frequency Oscillation
1
XTIN
XTOUT
C
2
TMP86FH09AMG

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