C8051F700DK Silicon Laboratories Inc, C8051F700DK Datasheet - Page 4

• Manufacturer Part Number: C8051F700DK
• Description: DEV KIT FOR C8051F700
• Manufacturer: Silicon Laboratories Inc
• Type: MCUr

Specifications of C8051F700DK

• Contents: Board, Cables, CD, Debugger, Power Supply
• Processor To Be Evaluated: C8051F7x
• Processor Series: C8051F7xx
• Interface Type: USB
• Operating Supply Voltage: 3.3 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With/related Products: C8051F7xx
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 336-1635

C8051F70x/71x
17. Memory Organization .......................................................................................... 108
18. External Data Memory Interface and On-Chip XRAM ....................................... 111
19. In-System Device Identification.......................................................................... 128
20. Special Function Registers................................................................................. 130
21. Interrupts .............................................................................................................. 137
22. Flash Memory....................................................................................................... 148
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16.2. CIP-51 Register Descriptions ........................................................................ 104
17.1. Program Memory........................................................................................... 109
17.2. EEPROM Memory ......................................................................................... 109
17.3. Data Memory ................................................................................................. 109
18.1. Accessing XRAM........................................................................................... 111
18.2. Configuring the External Memory Interface ................................................... 112
18.3. Port Configuration.......................................................................................... 112
18.4. Multiplexed and Non-multiplexed Selection................................................... 115
18.5. Memory Mode Selection................................................................................ 117
18.6. Timing .......................................................................................................... 118
21.1. MCU Interrupt Sources and Vectors.............................................................. 138
21.2. Interrupt Register Descriptions ...................................................................... 140
21.3. INT0 and INT1 External Interrupts................................................................. 146
22.1. Programming The Flash Memory .................................................................. 148
16.1.1. Instruction and CPU Timing .................................................................... 99
17.1.1. MOVX Instruction and Program Memory .............................................. 109
17.3.1. Internal RAM ......................................................................................... 109
18.1.1. 16-Bit MOVX Example .......................................................................... 111
18.1.2. 8-Bit MOVX Example ............................................................................ 111
18.4.1. Multiplexed Configuration...................................................................... 115
18.4.2. Non-multiplexed Configuration.............................................................. 116
18.5.1. Internal XRAM Only .............................................................................. 117
18.5.2. Split Mode without Bank Select............................................................. 117
18.5.3. Split Mode with Bank Select.................................................................. 118
18.5.4. External Only......................................................................................... 118
18.6.1. Non-Multiplexed Mode .......................................................................... 120
18.6.2. Multiplexed Mode .................................................................................. 123
21.1.1. Interrupt Priorities.................................................................................. 138
21.1.2. Interrupt Latency ................................................................................... 138
22.1.1. Flash Lock and Key Functions .............................................................. 148
17.3.1.1. General Purpose Registers .......................................................... 110
17.3.1.2. Bit Addressable Locations ............................................................ 110
17.3.1.3. Stack .......................................................................................... 110
18.6.1.1. 16-bit MOVX: EMI0CF[4:2] = 101, 110, or 111............................. 120
18.6.1.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 101 or 111 ....... 121
18.6.1.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 110 ....................... 122
18.6.2.1. 16-bit MOVX: EMI0CF[4:2] = 001, 010, or 011............................. 123
18.6.2.2. 8-bit MOVX without Bank Select: EMI0CF[4:2] = 001 or 011 ....... 124
18.6.2.3. 8-bit MOVX with Bank Select: EMI0CF[4:2] = 010 ....................... 125
Rev. 1.0