PIC18C242-I/SP Microchip Technology, PIC18C242-I/SP Datasheet - Page 291

• Manufacturer Part Number: PIC18C242-I/SP
• Description: IC MCU OTP 8KX16 A/D 28DIP
• Manufacturer: Microchip Technology
• Series: PIC® 18Cr

Specifications of PIC18C242-I/SP

• Core Size: 8-Bit
• Program Memory Size: 16KB (8K x 16)
• Peripherals: Brown-out Detect/Reset, LVD, POR, PWM, WDT
• Core Processor: PIC
• Speed: 40MHz
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 22
• Program Memory Type: OTP
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 4.2 V ~ 5.5 V
• Data Converters: A/D 5x10b
• Oscillator Type: External
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-DIP (0.300", 7.62mm)
• Controller Family/series: PIC18
• No. Of I/o's: 23
• Ram Memory Size: 512Byte
• Cpu Speed: 40MHz
• No. Of Timers: 4
• Processor Series: PIC18C
• Core: PIC
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: MSSP, SPI, I2C, USART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 23
• Number Of Timers: 1 x 16 bit
• Operating Supply Voltage: 2.5 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: 52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
• Development Tools By Supplier: ICE2000, DM163022, DV164136
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 5 bit
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: I3DB18C452 - BOARD DAUGHTER ICEPIC3
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

APPENDIX E:
A detailed discussion of the differences between the
mid-range MCU devices (i.e., PIC16CXXX) and the
enhanced devices (i.e., PIC18CXXX) is provided in
AN716, “Migrating Designs from PIC16C74A/74B to
PIC18C442.” The changes discussed, while device
specific, are generally applicable to all mid-range to
enhanced device migrations.
This Application Note is available as Literature Number
DS00716.
2001 Microchip Technology Inc.
MIGRATION FROM
MID-RANGE TO
ENHANCED DEVICES
APPENDIX F:
A detailed discussion of the migration pathway and dif-
ferences between the high-end MCU devices (i.e.,
PIC17CXXX)
PIC18CXXX) is provided in AN726, “PIC17CXXX to
PIC18CXXX Migration.” This Application Note is avail-
able as Literature Number DS00726.
and
the
MIGRATION FROM
HIGH-END TO
ENHANCED DEVICES
PIC18CXX2
enhanced
DS39026C-page 289
devices
(i.e.,