MC68HC908JB8JPE Freescale Semiconductor, MC68HC908JB8JPE Datasheet - Page 264

• Manufacturer Part Number: MC68HC908JB8JPE
• Description: IC MCU FLASH 8BIT 8K 20-DIP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC68HC908JB8JPE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 3MHz
• Connectivity: USB
• Peripherals: LVD, POR, PWM
• Number Of I /o: 13
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 4 V ~ 5.5 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 20-DIP (0.300", 7.62mm)
• Controller Family/series: HC08
• No. Of I/o's: 13
• Ram Memory Size: 256Byte
• Cpu Speed: 3MHz
• No. Of Timers: 1
• Embedded Interface Type: USB
• Rohs Compliant: Yes
• Processor Series: HC08JB
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: USB
• Maximum Clock Frequency: 3 MHz
• Number Of Programmable I/os: 37
• Number Of Timers: 2
• Operating Supply Voltage: 4 V to 5.5 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: Through Hole
• Development Tools By Supplier: FSICEBASE, DEMO908GZ60E, M68EML08GZE, KITUSBSPIDGLEVME, KITUSBSPIEVME, KIT33810EKEVME
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
19.3 44-Pin Plastic Quad Flat Pack (QFP)
Technical Data
264
SEATING
PLANE
–C–
DATUM
PLANE
–A–
C
E
–H–
H
44
34
33
1
G
0.20 (0.008)
0.05 (0.002) A–B
0.20 (0.008)
DETAIL C
–D–
W
Figure 19-1. 44-Pin QFP (Case 824A)
A
M
M
S
L
X
DETAIL A
H
C
K
A–B
A–B
M
S
S
R
T
Mechanical Specifications
D
D
M
Q
S
S
23
11
12
22
MC68HC908JB8•MC68HC08JB8•MC68HC08JT8 — Rev. 2.3
M
DETAIL C
–H–
–B–
DATUM
PLANE
0.10 (0.004)
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY AT THE
BOTTOM OF THE PARTING LINE.
DATUM PLANE –H–.
SEATING PLANE –C–.
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE DETERMINED
AT DATUM PLANE –H–.
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION
SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT.
0.20 (0.008)
DIM
G
M
Q
W
A
B
C
D
E
F
H
J
K
L
N
R
S
T
U
V
X
J
VIEW ROTATED 90
SECTION B–B
DETAIL A
12.95
12.95
MILLIMETERS
MIN
9.90
9.90
2.10
0.30
2.00
0.30
0.13
0.65
0.13
0.13
0.13
0.40
—
5°
0°
0°
Freescale Semiconductor
0.80 BSC
8.00 REF
1.6 REF
B
B
–A–, –B–, –D–
F
D
M
10.10
10.10
13.45
13.45
MAX
10°
2.45
0.45
2.10
0.40
0.25
0.23
0.95
0.17
0.30
—
—
—
7°
C
A–B
0.390
0.390
0.083
0.012
0.079
0.012
0.005
0.026
0.005
0.510
0.016
0.005
0.005
0.510
MIN
—
0.031 BSC
0.315 REF
5°
0°
0°
0.063 REF
°
INCHES
N
BASE METAL
S
MAX
0.398
0.398
0.096
0.018
0.083
0.016
0.010
0.009
0.037
0.007
0.012
0.530
0.530
D
10°
—
—
—
7°
S