F272-BAG-T-TR STMicroelectronics, F272-BAG-T-TR Datasheet - Page 143

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F272-BAG-T-TR

Manufacturer Part Number
F272-BAG-T-TR
Description
MCU 16BIT 256K FLASH 144-TQFP
Manufacturer
STMicroelectronics
Series
ST10r
Datasheet

Specifications of F272-BAG-T-TR

Core Processor
ST10
Core Size
16-Bit
Speed
40MHz
Connectivity
ASC, CAN, EBI/EMI, I²C, SSC, UART/USART
Peripherals
POR, PWM, WDT
Number Of I /o
111
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
20K x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 24x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
144-TQFP, 144-VQFP
Processor Series
ST10F27x
Core
ST10
Data Bus Width
16 bit
Data Ram Size
12 KB
Interface Type
ASC, CAN, I2C, SSC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
111
Number Of Timers
4
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 24 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
No

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
F272-BAG-T-TR
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
F272-BAG-T-TR
Manufacturer:
ST
0
ST10F272B/ST10F272E
The formula above provides a constraints for external network design, in particular on
resistive path.
A second aspect involving the capacitance network shall be considered. Assuming the three
capacitances C
equivalent circuit reported in Figure 40), when the sampling phase is started (A/D switch
close), a charge sharing phenomena is installed.
Figure 41. Charge sharing timing diagram during sampling phase
In particular two different transient periods can be distinguished (see Figure 41):
A first and quick charge transfer from the internal capacitance C
sampling capacitance C
considering a worst case (since the time constant in reality would be faster) in which
C
are in series, and the time constant is:
This relation can again be simplified considering only C
condition. In reality, the transient is faster, but the A/D Converter circuitry has been
designed to be robust also in the very worst case: the sampling time T
longer than the internal time constant:
The charge of C
voltage V
A second charge transfer involves also C
capacitance) through the resistance R
and C
time constant is:
In this case, the time constant depends on the external circuit: in particular imposing
that the transient is completed well before the end of sampling time T
P2
is reported in parallel to C
V
S
V
V
V
CS
A
A2
A1
were in parallel to C
A1
F
1
, C
on the capacitance according to the following equation:
P1
P1
Voltage Transient on C
and C
V A1
and C
τ 1
P2
2
S
<
P2
(
initially charged at the source voltage V
occurs (C
C S
τ 1
(
R SW
τ 2
P1
is redistributed also on C
=
+
P1
<
(since the time constant in reality would be faster), the
C P1
(
R L
R SW
(call C
+
R AD
S
+
(
S
is supposed initially completely discharged):
C P2
+
C S
L
: again considering the worst case in which C
)
P
R AD
T
= C
F
+
S
)
C S
(that is typically bigger than the on-chip
C P1
=
)
P1
∆V < 0.5 LSB
t
< <
V A
C P
----------------------- -
C P
+ C
+
C P2
T
+
P2
(
S
C P1
C S
C S
S
), the two capacitance C
τ
τ
)
, determining a new value of the
1
2
S
< (R
= R
+
as an additional worst
C P2
L
SW
Electrical characteristics
(C
)
S
+ R
P1
+ C
A
AD
and C
(refer to the
P1
S
) C
S
, a constraints on
+ C
is always much
S
<< T
P2
P2
)
to the
S
P
and C
143/182
P2
S

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