D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 131

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Figure 3.7 (b) H8S/2314 Memory Map in Each Operating Mode (F-ZTAT Version Only)
Notes: 1. External addresses when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
2. Reserved area when EAE = 1 in BCRL; on-chip ROM when EAE = 0.
3. On-chip RAM is used for flash memory programming. Do not clear the RAME bit to 0 in
4. Do not access the reserved area in addresses H'060000 to H'07FFFF.
5. Do not access the reserved areas.
SYSCR.
H'000000
H'010000
H'060000
H'080000
H'FFDC00
H'FFEC00
H'FFFC00
H'FFFE50
H'FFFF08
H'FFFF28
H'FFFFFF
(advanced expanded mode
with on-chip ROM enabled)
Mode 10 Boot Mode
External address
External address
External address
external address
Reserved area
Reserved area
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
space
Internal
Internal
space
space
space
*1
*3
*4
*5
H'000000
H'010000
H'060000
H'07FFFF
H'FFDC00
H'FFEC00
H'FFFBFF
H'FFFE50
H'FFFF07
H'FFFF28
H'FFFFFF
Rev.7.00 Feb. 14, 2007 page 97 of 1108
(advanced single-chip
Mode 11 Boot Mode
Section 3 MCU Operating Modes
Reserved area
Reserved area
On-chip RAM
On-chip ROM/
On-chip ROM
I/O registers
I/O registers
mode)
reserved
area
Internal
Internal
*2 *5
*3
*5
*4
REJ09B0089-0700

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