D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 656

IC H8S MCU ROMLESS 100-QFP

D12312SVTEBL25

Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheets

Specifications of D12312SVTEBL25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
Section 17 ROM
17.11.9 Programmer Mode Transition Time
Commands cannot be accepted during the oscillation stabilization period or the progremmer mode
setup period. After the progremmer mode setup time, a transition is made to memory read mode.
Table 17.24 Command Wait State Transition Time Specifications
Item
Standby release (oscillation
stabilization time)
Programmer mode setup time
V
Rev.7.00 Feb. 14, 2007 page 622 of 1108
REJ09B0089-0700
CC
Figure 17.29 Oscillation Stabilization Time, Programmer Mode Setup Time, and Power
hold time
V
RES
FWE
Note: Except in auto-program mode and auto-erase mode, drive the FWE input pin low.
CC
t
osc1
t
bmv
Symbol
t
t
t
osc1
bmv
dwn
Supply Fall Sequence
Memory read
mode
Command
wait state
Min
30
10
0
Auto-program mode
Auto-erase mode
Max
Command
wait state
Normal/
abnormal end
identification
t
dwn
Unit
ms
ms
ms

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