D12312SVTEBL25 Renesas Electronics America, D12312SVTEBL25 Datasheet - Page 757
![IC H8S MCU ROMLESS 100-QFP](/photos/28/61/286108/100-tqfp_sml.jpg)
D12312SVTEBL25
Manufacturer Part Number
D12312SVTEBL25
Description
IC H8S MCU ROMLESS 100-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Specifications of D12312SVTEBL25
Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
70
Program Memory Type
ROMless
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Program Memory Size
-
Other names
HD6412312SVTEBL25
HD6412312SVTEBL25
HD6412312SVTEBL25
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Note that memory read of the user MAT/user boot MAT can only read the program data after all
user MAT/user boot MAT has automatically been erased.
[2]
[4]
(Program end)
Wait for program data
programming/erasing
(reset by boot mode)
Boot mode initiation
setting command
Wait for inquiry
command
[3]
Wait for
Figure 17.67 Overview of Boot Mode State Transition
user boot MAT erasure
(Program command reception)
All user MAT and
(Program data transmission)
(Erasure end)
Inquiry command response
(Bit rate adjustment)
Inquiry command reception
Read/check command
reception
H'00 to H'00 reception
H'00 transmission
(adjustment completed)
Command response
(Erasure command reception)
read/check command
Bit rate adjustment
Wait for erase-block
Rev.7.00 Feb. 14, 2007 page 723 of 1108
Processing of
inquiry setting
Processing of
command
data
(Erase-block specification)
[1]
REJ09B0089-0700
Section 17 ROM
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